Tesla Dojo Chip Wiki

Published by Daniel Nenni on 08-04-2025 at 9:52 am
Last updated on 08-04-2025 at 9:54 am

Tesla Dojo Training Chip

Name: Tesla Dojo D1 Chip
Designed by: Tesla, Inc.
Announced: August 19, 2021 (AI Day)
First Deployment: 2023 (pilot systems), with full-scale training racks in 2024–2025
Fabricated by: TSMC
Process Node: N7 (D1 generation); future iterations expected on 5nm or 3nm
Use Case: Neural network training for autonomous vehicles and humanoid robotics
Architecture Type: Custom AI training ASIC with scalar, vector, and matrix execution units

Overview

The Tesla Dojo chip, known as the D1, is Tesla’s in-house AI training processor created to support its Full Self-Driving (FSD) vision system and robotics initiatives. Designed from the ground up, the chip enables massive-scale neural network training using vision data from millions of vehicles on the road. Dojo allows Tesla to break away from dependence on third-party GPUs (such as Nvidia), providing a vertically integrated AI compute platform.

Dojo is not a general-purpose processor—it’s purpose-built to optimize power efficiency, low-latency data exchange, and dense video-based training, which Tesla believes are essential for building real-world AI.

D1 Chip Technical Specifications

Feature Detail
Transistors ~50 billion
Die Size ~645 mm²
Cores 354 AI-optimized compute cores
Compute Style Custom scalar, vector, and matrix units
Fabrication TSMC 7nm process
I/O Bandwidth 4 TB/s (mesh edge-to-edge)
SRAM On-chip high-capacity SRAM (no HBM in v1)
Power Draw ~400 watts per chip in full tile config
Instruction Set Proprietary Tesla ISA
Interconnect Direct chip-to-chip via proprietary high-bandwidth mesh

Dojo scales up through modular tile-based compute systems:

Dojo Tile

  • 25 D1 chips in a 5×5 mesh grid

  • ~9 PFLOPs of FP16/BF16 performance per tile

  • Chips interconnected with edge-mesh routing

  • Designed for minimal communication latency

Rack and Exapod

  • 10 tiles per tray, multiple trays per cabinet

  • Dojo cabinet includes power delivery, cooling, and switching

  • Dojo Exapod = 120+ tiles → 1+ ExaFLOP of compute (FP16)

Tesla envisions Dojo Exapods as AI factories for self-driving models, Tesla Bot (Optimus), and broader real-world AI applications.

Software Stack

  • Custom compiler and scheduler for Tesla’s AI workloads

  • Tensor and graph compilers optimized for Dojo ISA

  • End-to-end vertical integration: silicon → tile → compiler → data pipeline

Roadmap Timeline

Year Milestone
2021 Tesla AI Day unveils Dojo D1
2022 First tiles validated
2023 Production-scale Dojo cabinets come online
2024 Multi-exapod systems deployed for FSD, robotics
2025 Expected D2 chip on 5nm or 3nm, potentially with HBM

Strategic Importance

  • In-house training hardware accelerates AI development without Nvidia

  • Enables massive video dataset training for autonomy at lower cost

  • Supports AI model iteration speeds that Tesla claims outperform traditional cloud clusters

  • Platform for future humanoid robot training (Optimus)

Notable Quotes

“This is not a chip, it’s a training supercomputer in disguise.”
Ganesh Venkataramanan, Tesla Dojo Project Leader (AI Day 2021)

“We’re using video-level data to train our models. That requires orders of magnitude more compute than tabular or text data. Dojo makes that possible.”
Andrej Karpathy, Former Tesla Director of AI

“Dojo will be the fastest AI training computer in the world.”
Elon Musk, Tesla Q3 2023 Earnings Call

“Dojo is optimized for bandwidth and scalability, not just peak FLOPs.”
Pete Bannon, Tesla chip architect, ex-Apple PA Semi

“With Dojo, we’re building something that nobody else is building—we’re optimizing for the real world, not just benchmarks.”
Elon Musk, Tesla AI Day 2021

“We built every part of Dojo ourselves—cores, interconnect, memory fabric, software. It’s Tesla silicon, end to end.”

Comparison with Nvidia and Google

Feature Tesla D1 (Dojo) Nvidia H100 Google TPU v5e
Process TSMC N7 TSMC N4 TSMC N5
Cores 354 132 (Streaming Multiprocessors) Unknown
Peak FP16 ~362 TFLOPs (per chip) 989 TFLOPs ~400 TFLOPs
Interconnect Mesh NVLink TPU interconnect
Memory SRAM HBM3 HBM
Target Use Vision AI, FSD LLMs, GenAI ML training/inference
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