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New Vivado Release. And a Competition!

New Vivado Release. And a Competition!
by Paul McLellan on 12-29-2014 at 5:00 pm

It is not entirely clear what Xilinx is these days. Of course it is an FPGA company. If you hear the word FPGA then I bet Xilinx is the first thing you think of. But what Xilinx ships these days is a far cry from the type of device it created when it was starting, where FPGAs were largely used to vacuum up all the glue logic around the processors and memories on a circuit board. Back in those days a microprocessor was a whole chip and it wasn’t possible to embed one. Now an entire system can be implemented in a Xilinx part. But one key part of the whole system is the Xilinx software toolchain Vivado that is used to program the devices, often starting from Verilog or VHDL but increasingly from C/C++, especially when the person writing the code is actually a software engineer with no (or limited) hardware design experience. As the design of systems moves to the higher level, increasingly the design is being done by engineers who do not know RTL.


Xilinx has just announced a suite of new capabilities in the software with the release of Vivado 2014.4. This release adds support for many of the 28nm and Ultrascale devices in particular the Artix-7 and Zynq-7000 including the recently announced low power/speed grades. The full table of supported devices is above.

More information on Vivado is here.

See also Xilinx Announces SDAccel, Accelerators for the Datacenter


Another feature is the partial reconfiguration capability. I wrote about this earlier in the context of the SDAccel. Partial reconfiguration allows the array to be partially reprogrammed without requiring the entire bitstream to be reloaded. Indeed, the part of the array not being reprogrammed can continue to operate at the same time, allowing a large array to be dynamically loaded with whatever functionality is required at that time.

Peeling back one more layer of the onion, partial reconfiguration allows for the dynamic change of modules within an active design. This flow requires the implementation of multiple configurations which ultimately results in full bitstreams for each configuration, and partial bitstreams for each Reconfigurable Module. The number of configurations required varies by the number of modules that need to be implemented. However, all configurations use the same top-level, or static, placement and routing results. These static results are exported from the initial configuration, and imported by all subsequent configurations using checkpoints.

More information on partial reconfiguration is here.


It is also time for the Vivado Design Leadership Awards. There are two categories:

  • All programmable design leadership focusing on designs using Xilinx FPGAs and 3D ICs
  • Smarter systems design leadership focusing on designs using Xilinx Zynq-7000 all-programmable SoCs, hardware and software programmable devices enabling rapid design and implementation of smarter systems

As Xilinx themselves say:
We are looking for the best of the best. To enter, applicants should submit their design in technical paper format. The winners will be honored with public recognition via a press release, promotion within Xcell Publications, a glass design leadership award for the winners, an award plaque prominently displayed at Xilinx Headquarters in San Jose, California and the opportunity to present the winning technical paper at the Club Vivado Users Group 2015.

To enter go here.

More articles by Paul McLellan…


Top Ten Semiconductor CEOs in 2014!

Top Ten Semiconductor CEOs in 2014!
by Daniel Nenni on 12-29-2014 at 7:00 am

Since my blog about the Intel CEOs went over so well (sarcasm) I thought I should write more about semiconductor chief executive officers. This list comes from David Manners of Electronics Weekly who, unlike me, is a real journalist. Using David’s list as a starting point I will add more candidates at the end and please add yours in the comment section. If you agree or disagree with names on the list feel free to share your opinions, observations, and experiences. Let’s crowd source a top ten list and take a closer look to see what really makes a great semiconductor CEO. One thought I had was to put together a list of questions for the top ten CEOs. If you folks help put together a list I will get the answers, absolutely.

For readability purposes I have provided a link to their full biographies since they are very distinguished men with long lists of accomplishments. I did however include their education since I personally feel it is a qualified data point for a semiconductor CEO.

Syed Ali, President & CEO, Cavium Networks
MSE, University of Michigan

Dr. Jalal Bagherli, Chief Executive Officer, Dialog Semiconductor
Ph.D., Electronics, Kent University, UK

Dr. Oh-Hyun Kwon, Chief Executive Officer of Samsung Electronics Co.
Ph.D., Electrical Engineering, Stanford University

Scott McGregor, President and Chief Executive Officer, Broadcom
MS, Computer Science and Computer Engineering, Stanford University

Ming-Kai Tsai, Chairman & CEO, MediaTek
MSEE, University of Cincinnati

Jen-Hsun Huang, co-founder, president, chief executive officer, NVIDIA
MSEE, Stanford University

Dr. Sehat Sutardja, Chairman and CEO and Co-Founder, Marvell Technology Group
Ph.D., EE and CS, University of California at Berkeley

Behrooz Abdi, President and CEO, InvenSense
MSEE, Georgia Institute of Technology

Dr. Leo Li, Chairman, CEO and President, Spreadtrum Communications
Ph.D., Electrical Engineering, University of Maryland

Steve Mollenkopf,Chief Executive Officer, Qualcomm
MSEE, University of Michigan

To this list I would add:

Moshe Gavrielov, President & Chief Executive Officer, Xilinx
MSCS, Israel Institute of Technology

Fermi Wang, CEO, Ambarella
Ph.D,Electrical Engineering, Columbia University

Dr. Reinhard Ploss, Chief Executive Officer, Infineon Technologies
Ph.D.,Chemical Engineering,Technische Universität München

Sanjay Mehrotra, Co-Founder, President and Chief Executive Officer, Sandisk
MSEE and CS, University of California, Berkeley

Dr. Sanjay K. Jha, CEO of GLOBALFOUNDRIES
Ph.D. in Electronic and Electrical Engineering, Strathclyde University, Scotland

Mark Durcan, Chief Executive Officer, Micron
Master of Chemical Engineering, Rice University

Honorable mention: I did not include Dr. Morris Chang since he is not CEO or Dr. Mark Lui and Dr. C.C. Wei since they are TSMC Co-CEOs. I would have also liked to Include Dr. Aart de Geus and Dr. Walden Rhines but they are EDA CEOs. And Sir Hossein Yassaie CEO of Imagination Technologies but that is semiconductor IP.


Fabless Semiconductor Milestones of 2014!

Fabless Semiconductor Milestones of 2014!
by Daniel Nenni on 12-28-2014 at 9:00 am

After working in the semiconductor industry for the past thirty years and writing about it for the past six I would say that 2014 was one of the more interesting years of late. Vindication is the word that pops into my mind now that many “predictions” the fabless detractors have made over the last three years were proven wrong.

As a student of history I think it is important to look at the past to better prepare for the future which is one of the reasons why I blog. Blogging also enabled us to write our book on the history of the fabless semiconductor industry. To take a look back, SemiWiki members can click on the company names or industries (categories) in the header of the blog summaries to see what we have written on that company or market segment. You can also click on the author to see what each of us have written, simple as that.

In 2014 814 blogs were published on SemiWiki bringing the total to 2134 written by 42 different people. According to Google, SemiWiki has recorded 1,245,650 unique viewers since going online in 2011. The big data (analytics) behind all of this activity is truly amazing.

2014 also brought my 30th wedding anniversary which my beautiful wife and I celebrated in Hawaii. She runs the financial side of SemiWiki and edits everything I write. 30 more years is going to be no problem at all.

Some of the top viewed blogs I wrote in 2014 include:

[LIST=1]

  • GLOBALFOUNDRIES Acquires IBM Semiconductor Unit!
  • Intel Core M vs Apple A8!
  • Is Intel the Concorde of Semiconductor Companies?
  • TSMC Responds to Intel’s 14nm Density Claim!
  • TSMC vs Intel vs Samsung FinFETs
  • Who is Using Samsung 14nm?
  • More Apple A9 Ridiculousness!
  • Who will Manufacture Apple’s Next SoC?
  • TSMC Updates: 20nm, 16nm, and 10nm!
  • Samsung 14nm is the one delayed!

    I agree with this ranking 100%. The GF/IBM deal was by far the most exciting thing to happen in 2014. I have written about GF 46 times over the last 5 years and the IBM acquisition blog was viewed 5 times more than the average. It really could be a game changer for the fabless semiconductor industry. The pure-play foundry business model is what delivered supercomputing to our fingertips (literally) so that business model must continue at all costs. Seriously, IDM foundries do not have our collective best interests in mind as history has clearly shown.

    The most controversial event was the release of the TSMC 20nm A8 and A8x making Apple one of the leading fabless semiconductor companies. Not only was this Apple’s first pure-play foundry chip it was also the first time Apple designed two SoCs, one for the iPhone and a higher performance version for the iPads. Even though South Korea press said this would be a Samsung chip we all knew it would be TSMC and it would yield in time for the iPhone6 launch in Q3 2014. The other thing the A8 brought was a fresh perspective on the Intel process density superiority claims.

    The word vindication also comes to mind since so called industry experts claimed that 20nm would not be in high volume production “until 2015 but mostly 2016”. People also doubted the foundries would produce FinFETs in 2015 and one gentleman predicted that it wouldn’t happen until 2017 and 10nm would also be delayed. Clearly that is not the case so congratulations to the hard working people of the fabless semiconductor ecosystem that proved experts, competitors and the outside media wrong, absolutely.


  • Op-amps moving toward zero-drift, greater voltage range

    Op-amps moving toward zero-drift, greater voltage range
    by Majeed Ahmad on 12-27-2014 at 7:00 am

    Operational amplifiers, which are among the most widely used analog components found in nearly all types of electronic systems, are migrating toward zero-drift capability and much-greater range of voltages at the supplies and the inputs. Take Linear Technology Corp.’s LTC2057HV, a zero-drift operational amplifier, which features self-calibrating circuitry that provides high DC precision and stability over changes in temperature, time, input range and supply voltage. The LTC2057HV components claim to offer optimal combination of low voltage noise, low current noise and low input bias current, while the zero-drift architecture cancels 1/f noise.

    Operational amplifier – commonly known as op-amp – is one of the basic building blocks of analog electronics for functions such as filters. It’s a linear device that boasts all the properties required for nearly ideal DC amplification and is therefore used extensively in signal conditioning, filtering or to perform mathematical operations such as add, subtract, integration and differentiation. An op-amp is basically a three-terminal device which consists of two high impedance inputs, one called the inverting input, marked with a negative or “minus” sign, ( – ) and the other one called the non-inverting input, marked with a positive or “plus” sign ( + ).


    Operational amplifier block diagram

    A wider range of supply and input voltages is critical because high supply-voltage amps are powered by systems that connect to power systems, automobiles, or large battery packs. Here, the amplifier’s input may be connected to hundreds of volts, but amplifying signals will still be operating in the microvolt range. On the other hand, high-voltage amplifiers also offer features to improve system performance, cost, and robustness, while easing the complexity of system design. The second key element in the ongoing op-amp evolution is zero-drift – a technique originally developed to address constantly changing temperature as well as drift over time. The zero-drift amplifiers dynamically correct offset voltage as well as reshape noise density.

    Linear’s LTC2057HV amplifier offers more than 140dB dynamic range while operating on a 60V (±30V) supply. “This wide dynamic range enables tiny signals to be amplified in the presence of much larger signals without saturating the amplifier or losing precision,” said Brian Black, product marketing manager for signal conditioning products. Here, spurious artifacts normally associated with zero-drift amplifiers are suppressed, further extending the dynamic range, stability and useful signal bandwidth.

    For applications requiring supply voltages of up to 36V, a lower supply version of LTC2057 is also available. Both LTC2057 and LTC2057HV components – operating over a -40°C to 125°C temperature range – claim to offer low voltage noise, low current noise and low input bias current, while the zero-drift architecture cancels 1/f noise. The input common-mode range includes the negative rail and the output swings rail-to-rail, which makes the LTC2057 component suitable for single- and dual-supply industrial, instrumentation and automotive applications.

    The LTC2057 part is available in 3mm x 3mm DFN, MSOP-8 and SOIC-8 packages, as well as an MSOP-10 package with a pin-out that enables a guard ring to be easily routed around the input to preserve the high precision and low noise performance at high source impedance.


    Linear’s 60V zero-drift op-amp

    High-speed op-amps

    Exar Corp., another supplier of analog and mixed-signal chips, has recently launched the XR805x family of high-speed operational amplifiers for applications such as video distribution and surveillance systems. These operational amplifiers are widely used in a vast array of consumer, industrial, and scientific devices.

    Exar claims that its operational amplifiers will lower the overall system power consumption and provide higher precision for improved performance. “The XR805x family offers customers an opportunity to make their designs more power efficient and at the same time, improve performance,” said Dale Wedel, Exar’s vice president of High Performance Analog product line. “These pin-for-pin drop-in replacements allow customers to lower power consumption in existing platforms and offer performance enhancements that enable next generation designs.”

    The XR805x family of devices is targeted at applications including professional and IPC cameras, active filter circuits, coaxial cable drivers, and electronic white boards. The amplifiers can drive four video loads and operate from a wide supply voltage range to accommodate general-purpose, high-speed applications where dual supplies of up to +/- 6V or single supplies from +2.7V to +12V are required.

    Amplifiers often pick up a small signal in a hostile environment and then ride on top of a larger signal. These highly versatile components are the unsung heroes in most of the electronic systems. Op-amps are an increasingly important part of the amplifier recipe, and they are likely to play a crucial part in the future for their role in a diverse range of applications.

    Majeed Ahmad is the author of Smartphone, Nokia’s Smartphone Problem, Mobile Commerce 2.0and Essential 4G Guide.He has been writing for technology and trade media for more than 19 years.


    Riding the Wave of Silicon Magic in 2015!

    Riding the Wave of Silicon Magic in 2015!
    by Daniel Nenni on 12-26-2014 at 7:00 am

    2014 was a busy year for SemiWiki. We attended dozens of events, met hundreds of people (if not thousands), and published 810 blogs and a book that reached more than half of a million people. We collaborated throughout the fabless semiconductor ecosystem all year long and let me tell you it has been an amazing mind expanding experience, absolutely.


    Next year will be even bigger for SemiWiki and the fabless semiconductor ecosystem and it all starts with the first SEMI Industry Strategy Symposium (ISS) at the Ritz Carlton in Half Moon Bay. Here are just a few of the topics that will be covered:

    • Riding the Wave of Silicon Magic–Broadcom
    • Internet of Everything (IoE) – Supply Chain Transformation–Cisco Systems
    • The Future in a World of Digitized Defined Objects–Consumer Electronics Association
    • Transforming a Business for Success–Honeywell
    • Imagine How Genomics Will Transform Our Future–Illumina
    • Technology Innovation in an IoT Era–IMEC
    • IoT– The Next Technology Revolution–Intel
    • Enabling Moore’s Law through Materials Innovation–Intel
    • Top-10 Economic Predictions for 2015–IHS
    • Industry Dynamics and Growth Trends for Semiconductor Wafer Fab Materials–Linx Consulting
    • Mapping Innovations to Growth: Assessing the Impact of Emerging Technologies in Autonomous Systems, Internet of Things, Wearables, and 3D Printing–Lux Research
    • Semiconductors in 2015–Where Are We and Where Are We Going?–McKinsey and Company
    • A Geopolitical Forecast: Trends Shaping Semiconductor Manufacturing Countries–Stratfor
    • The Cycle: Is it Different This Time?–VLSI Research

    With an incredible lineup of speakers from Altera, Boeing, Broadcom, Cisco, IBM, IMEC, Intel, Micron, Qualcomm, Samsung, and TSMC, here is the premise of the symposium. It is definitely worth a read. Paul McLellan and I will both be there and it would be a pleasure to meet you!

    Since the dawn of computing, the semiconductor industry has been the enabler for the major innovations in the electronics industry. Moore’s Law has been the foundation for semiconductor industry economics. It laid the groundwork for the PC revolution, pervasive use of the internet, and the emergence and dominance of mobile devices, and each wave created renewed demand and prosperity in the semiconductor industry. In recent years, demand for semiconductors, and with it growth, has slowed to single digit numbers. Exploding costs for developing and manufacturing these state-of-the-art devices has led to major consolidations, first among device makers and then among the equipment and material suppliers. Although this may be healthy, profitable growth is necessary for the re-investment needed to continue the silicon magic and create the next wave of innovations that will generate demand for more device capability.

    While the above natural forces are in play, mobility and availability of tablets and smart phones for the masses, coupled with the exciting possibilities that the Internet of Things can bring, could potentially lead to increased growth in ICs. Further, continued efficiencies and shifts in the value chain caused by deeper collaboration between fabless and foundries on one hand, unique capabilities that IDMs deliver on the other, and the entry of some IDMs to the foundry sector, should generate new dimensions in the supply chain’s quest to create value.

    ISS 2015 explores the trends taking place in the industry from economic, market, technology, and manufacturing perspectives. In addition, the conference will look at ways to address the demands for continued development and manufacture of advanced technology. How should the supply chain respond to create increased value for customers, no matter where in the supply chain they reside? And most importantly, what should the industry do to maintain and increase prosperity to meet this demand in order to continue to sustain future growth? As always, the final goal is to help semiconductor industry executives set their strategies to navigate this exciting and rapidly changing environment.

    SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.


    Methodology Help for Analog IC Designers

    Methodology Help for Analog IC Designers
    by Daniel Payne on 12-25-2014 at 7:00 am

    Digital designers are more numerous than analog IC designers, and so they tend to get more attention from EDA vendors in terms of tools and automation methodologies. For an analog design team with specialists focused separately on schematics and layout there are several methodology questions that need to be addressed, like:

    • Is this the right library for my project?
    • Are the cells the right version?
    • Do the views match (documentation, schematics, layouts, RTL, etc.)?

    I did some research and found a new five page white paper about this topic written by engineers at Methodics, titled: Release Methodology for Analog Design. You may download the PDF document after a registration process. The basic premise is that analog designers can now use a methodology with data management tools in order to collaborate better and enhance productivity.

    Related – IC Design at ZMDI

    In the Methodics methodology you continue to work with familiar IC tools like Virtuosofrom Cadence, and then have new data management menus included so that you’re not playing CAD engineer and cobbling together scripts to integrate with tools like Perforceand Subversion.


    VersIC menus in Virtuoso

    With this approach the members on an analog design team can quickly perform data management tasks like check-in and check-out cells, hierarchical operations, visual diff and merge operations, plus workspace management. Another useful concept with the VersIC tool is making a release, which is something you do when a qualified snapshot is required. A release will contain a list of all the files needed in your design, along with version numbers that have been qualified. You get to define what qualification means, so it could be that the file passes a simple test all the way up to a range of tests. Your design could be a single library of cells, or even multiple libraries that are related.

    Related – Effective Bug Tracking with IP Sub-systems

    Two approaches are used to organize your files in a release:

    [LIST=1]

  • Using Tags or Labels that refer to a set of files, each with a version number.
  • Have a Filelist.

    A Release Filelist diagram

    The VersIC tool on releases will use a combination of both Labels and Filelists to provide both performance and flexibility. Anyone on the design team can create a release using the GUI, and you can see all the details for the release: IP Name, Date, User, Comments, etc.:

    The Release command in VersIC

    Each release is checked for consistency before creating a new release ID.

    Related – IP and Design Management Done Right

    Workspaces are managed by choosing which release to work on. Typically you would update your workspace with the latest Release, which would update all the files to the proper versions of that Release. Alternative ways of updating your workspace include:

    • Keep Local Changes – don’t update files with local changes.
    • Promote – only update local changes if the released file is later.
    • Exact – make all files exactly match the release.

    On a design team with separate circuit design and layout groups, the circuit designer can make updates to schematics and then create a Release. On the layout side the engineer can then update their specific workspace to that Release, only receiving the latest changes of interest.

    Summary

    A release flow can now be used by members of an analog IC design team allowing them to collaborate and ensure correctness. The Methodics approach integrates the data management tools from Perforce or Subversion into Virtuoso in a transparent fashion, and extends the Cadence GUI with an easy to use and learn system. The complete white paper is here.


  • Variation: How Can We Survive?

    Variation: How Can We Survive?
    by Paul McLellan on 12-24-2014 at 12:57 pm

    At IEDM last week Coventor hosted a panel session as they do each year. The theme this year was surviving variation. The panel was hosted by someone whose name is familiar round here, Dan Nenni. The panel that Coventor had put together had people from all sorts of different slots in the design/supply chain for semiconductor. Unfortunately the participant companies would not release the slides so this is all from my scribbled notes on the evening.

    First up was Rich Wise of Lam Research. He emphasized that variation is really about the limits to semiconductor yield. High variation and yield is poor and you can’t ramp a process to volume. Indeed, ramping a process to volume is largely about getting variation under control.

    Next was Jan Hoentschel of GlobalFoundries. Of course keeping variation under control is absolutely key for a fab. Firstly, it is the key component for yielding a new process (or an existing one for that matter, fabs do occasionally “lose” the process). But foundries have another way of dealing with variation other than reducing it. They can put large variation parameters into their PDKs. But this transfers the problem elsewhere and if there is too much variation it simply becomes impossible to design for the process. Since foundries only make money when designs go into production this is economic suicide.


    Next was David Fried, Coventor’s CTO. One of the ways to get variation under control is to run lots of wafers. But with a modern process that takes too long and costs too much. So the alternative is to model the process (would that be with Coventor’s SEMulator 3D by chance?) which allows you to add variation at the process step level and then measure the impact on yield, timing and so on without building wafers. In old processes the connection was fairly simple (gate length a little long, slower timing and so on). But a modern process has so many steps and complex multi-pattern lithography, that that is no longer the case and a good physical model feeding into good TCAD models is required.

    Jeff Smith, from TEL (Tokyo Electron) America, sells semiconductor equipment (aka tools). He pointed out that it is no longer enough for them to sell equipment and let the customer worry about getting the yield up. They need to work out how to use their own equipment to reduce variation, by things like building sacrificial trenches to cut off some of the more extreme out-of-spec steps.

    Tom Dillinger of Oracle said that he felt more like he was in the left-field bleachers trying to call the strike zone accurately while everyone else was up near the plate. He is at the mercy of variation. If the manufacturing processes can’t get it down then it shows up in his technology files and it makes it much harder to actually do a design. Closing timing/power/electrical etc just doesn’t converge if variation is too high. And modern processes, with double patterning in particular, are making things worse.

    Last up was Tomasz Brozak of PDF solutions. They sell software for managing process yield, measuring (and thus improving) lithography. And so on. As I said above, improving yield is largely about reducing variation without letting costs get out of control.

    The big message of the evening is that you cannot handle variation by worst-casing everything because they you find that having invested billions of dollars in a fab for a new process, and having moved the performance up nicely for the typical values in the center of the distribution, that now the spread (standard-deviation) is so large that worst case has hardly moved at all. Everyone, from equipment manufacturers to foundries to EDA suppliers need to replace worst case with accuracy. Everyone on the panel was making some contribution to that cause, narrowing the spread of the most important parameters so that design and high-yielding manufacturing is possible.


    More articles by Paul McLellan…


    Is Fab Business The Forte of APAC?

    Is Fab Business The Forte of APAC?
    by Pawan Fangaria on 12-23-2014 at 6:00 pm

    A little ago, I was looking at the top20 semiconductor companies in the world and was surprised to see a couple of large companies in Taiwan and South Korea garnering >34% of total sales (See – Look who is Leading the World Semiconductor Business). This time it’s another surprise, when I look at IC Insights report on global 300mm fab capacity. Is this semiconductor business, considered to be a top high-tech and capital intensive area, becoming the forte of Asia Pacific, more specifically East Asia region? Look at this bar chart representing the share of worldwide 300mm wafer capacity based on fab location as well as fab’s headquarter location –

    If we combine the share of Japan, South Korea, Taiwan and China, the combined share of fabs by location sums up to 74% and that by their headquarter location sums up to 72%; that’s massive. Europe’s share looks miniscule compared to others.

    South Korea and Taiwan look interesting. Just two companies, Samsungand SK Hynix, in South Korea, not only have 28% share in their home land; they also have fabs outside Korea. In Taiwan, most of the fabs have their headquarters there only. Similarly Japan has 14% fabs with headquarters and 17% fabs located there.

    In North America, a wide contrast is visible; while 28% of fabs are owned there, only 15% are located there. The reason is obvious – cost other than fab expertise available in other specific regions; Semiconductor fabrication in one business which cannot be done without requisite long-run expertise, North America gets that with added cost benefit by setting up fabs in other regions.

    Again, if we look at the capacity utilization, Bill Jewell’s blog tells the story. The capacity is only rising, TSMCand UMC remaining between 80% to 90% and more utilization. What can explain their capacity utilization being higher than the world average? The foundry services, specifically by the foundries in Taiwan, for the rising world of fabless companies across the world. Today TSMC provides fabrication of chips to its design house customers at top-notch process nodes.

    When economic, business and technical forces combine together for a particular domain, then that creates a critical work force, ecosystem and leadership around that domain in the particular region. Are we seeing East Asia at the leading edge of semiconductor fabrication and semiconductor business in general for the next 5-10 years?

    More Articles by PawanFangaria…..


    Kathryn Kranen at IEDM

    Kathryn Kranen at IEDM
    by Paul McLellan on 12-23-2014 at 7:00 am

    It is the 50th year of IEDM, the International Electron Devices Meeting. The fact that it has been going for so long reveals why it has such an odd name: back in 1964 most “electron devices” were tubes (valves in UK lingo). This year they gave all of us a USB stick with all the papers from all 50 years of the event, something that would have been unbelievable to even think about during the first conference when a few bits of memory would cost a king’s ransom.

    This year at lunch on Wednesday there was an IEDM/Women in Engineering co-sponsored lunch. The setup was Kathryn Kranen, most recently CEO of Jasper Design Automation, being interviewed by Thuy Dao of Freescale.

    Thuy started by asking Kathryn about the early part of her career. She studied in Texas and then worked for Rockwell, firstly in board design and then in ASIC design. She was then recruited by Daisy Systems (in Texas) and eventually moved to headquarters in Sunnyvale (in what are now Synopsys’s buildings I presume). Initially she was an application engineer. She then moved to Quickturn and learned to be a bag-carrying salesperson with a product that didn’t really work and wasn’t selling well. Technical products simply do not sell themselves. Quickturn went public (and would eventually be acquired by Cadence, the Palladium product line is the descendent of those original products).

    Kathryn went to Verisity, at the time an Israeli startup. She ran the US subsidiary and got it profitable. She left when she got pregnant and Moshe Gavrielov (now CEO of Xilinx) took over. Verisity went public so presumably Kathryn made some money and she was retired for 4 years bringing up her children.

    In 2002 Jasper recruited her to be CEO. At the time there were 6 people. She closed 2 rounds of funding but after a couple of years the market froze. All 3 big EDA companies had their own formal products (from acquisitions) and so customers stopped being interested since they had a formal product that was “good enough” and bundled into big deals. The founders left Jasper and recruited many of their friends so they ended up with only one of the original software developers. Luckily they had a couple of loyal customers, Sony and Cisco, who kept buying. Then they started to grow again. They opened their Brazil development site that eventually became the largest. And it turned out that their technology really was the best and JasperGold started to become the market leader.

    So Jasper needed to decide what to do. They were more profitable and had more revenue than prior EDA IPOs such as Verisity. But post Sarbanes-Oxley that is not enough any more. It would be another 3-5 years to get big enough to go public. So they decided to sell. They had just gone through a failed acquisition when they discovered bad stuff during due diligence. So they decided to spend a lot on cleaning up the books, putting all the documentation online and generally making it so that once an acquisition process started it would go fast. They had regular meetings with two companies, one of which was Cadence (and I don’t think you win any prizes for guessing the second). Cadence made a lowball offer that they turned down, then they grew 35% in one year and Cadence came back with something acceptable. They didn’t use an investment banker.

    So, Thuy asked, what are the 3 lessons for a startup from founding to liquidity?

    [LIST=1]

  • The real enemy is time. Don’t wait for everything to be perfect or the market will pass you by.
  • It is all about the customers. They need to be willing to pay for your products. Don’t give it for free to early customers. Jasper’s first customers paid more than later ones but they got the entire company including all of engineering working for them. If the customers pay a lot of money they will invest effort to make the product work, whereas if they get it for next to nothing they will walk away.
  • Don’t clling to things that are not working, find people you need and be picky about team members.

    One thing Jasper did is not spread itself thinly. At the time Cadence acquired them they only had 25-30 customers but each on was a $1M customer. A couple of customers paying $1M is much better than 20 customers paying $50K. How hard will they work on a cheap product that is not yet mature and working cleanly?

    Kathryn was asked about whether she was treated differently as a woman. She said that at the time she didn’t think so but now looking back she can see some weirdness. She has recently got involved in STEM mini-course at the middle school that her 8th grade daughter goes to. But it is necessary to have an explicit conversation about the biases and not pretend. For example, there is a recent Barbie book about designing a video-game. Barbie designs it but then when it comes to writing the code she needs to find some men. Not exactly the ideal message!

    Kathryn is currently temporarily retired. And she has no wish to return to EDA (because it is all tiny companies or huge ones) but she would like to work for a 100-150 person company, probably some sort of B2B software since that is what she knows. Expect to see her around soon!


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  • Components for Wearables, Making the IoT Real

    Components for Wearables, Making the IoT Real
    by Paul McLellan on 12-22-2014 at 4:12 pm

    The screenwriter William Goldman is famous for saying that in Hollywood “Nobody knows anything.” Meaning that there is simply no way for any of the people involved to be able to predict which movies will turn out to be hits and which will be flops. I think the internet of things (IoT) is going to be like that. There will be products that turn out to be big successes and other products that smarter people than me decide to green-light that go nowhere. That is one of the reasons that I don’t think that IoT is a big market for SoC designs, more for microcontrollers and software, at least until it is clear which of the mud thrown against the wall has stuck firmly and so the ROI on doing an SoC is clear.

    One aspect of IoT that will be important is programmability. Obviously at the software level but the capability to repurpose the hardware will also be important. One area that is a special challenge is that at least part of the system needs to be “always on” despite the requirements for low power. A device like a fitbit cannot count your steps if it is not awake to count them. But having the primary microprocessor on all the time will blow the power budget. So there needs to be a divide and conquer approach, with an always on extremely low power device that only occasionally wakes up the main processor to handle the data and, perhaps, upload it into the cloud. For example, a step counter may be awake 25 times per second but only give data to the microprocessor to handle step counts every second or two and only power up the network connection even less frequently.


    Last week Quicklogic announced the TAG-N wearable sensor hub evaluation kit, in collaboration with Nordic Semiconductor. This incorporates the ArcticLink 3 S2 sensor hub, Quicklogic-developed algorithms and a direct connection to a Nordic Semiconductor nRF51 Dk, their all-in-one multiprotocol development kit for ultra-low power wireless development. This enables system designers to test and develop Bluetooth Smart (what used to be called Bluetooth Low Energy) wearable devices. The sensor hub consumes only 150uW of power while processing pedometer, gesture and context. This is a reference design for wearables suitable for fast prototyping as well as a demonstration of the effectiveness of the algorithms.

    Quicklogic will be attending CES in Las Vegas January 6-9th. Their hospitality suite is MP25452, South Hall 2 in the convention center. Meetings are by appointment only. Go here to reserve a time.

    They are also participating in a panel – Getting to Low Power and Maximum Functionality through Sensor Fusion Presented by MEMS Industry Group, Room: Marco Polo 702 (Venetian, Level 1) on Tuesday, Jan. 6, 3:30 – 4:30 p.m. Dr. Tim Saxe, QuickLogic’s CTO, will join panelists from InvenSense, Bosch Sensortec, PNI Sensor and STMicroelectronics to discuss how consumer OEMs and embedded systems integrators can take full advantage of MEMS and sensors for wearable devices.

    But wait, there’s more. And not steak knives. They will also be at the MEMS Alliance Technology Showcase, booth 72032, Tech West, Sands Expo, Level 2.


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