Siemens Enhances Supply Chain Visibility with Real-Time Intelligence for its Xcelerator Platform

Siemens Enhances Supply Chain Visibility with Real-Time Intelligence for its Xcelerator Platform
by Kalar Rajendiran on 07-11-2023 at 6:00 am

siemens xpedition supplyframe opengraph 1200x630

 

Next generation electronic systems require an engineering approach incorporating a digital twin methodology for early verification with digital prototypes. Over the course of a design project, the digital twin model evolves to allow more complex interactions including analysis, simulations and validations earlier… Read More


Webinar: Xpedition Product Update for VX.2.6

Webinar: Xpedition Product Update for VX.2.6
by Daniel Payne on 08-28-2019 at 12:04 pm

Overview

The VX.2.6 release for Xpedition Enterprise brings a significant update to the core PCB design flow, as well as cross-domain integrations with other Siemens technologies. This session will talk about specific improvements in design capture, layout, data management, and design validation. It will also cover functionality… Read More


Mentor Automating Design Compliance with Power-Aware Simulation HyperLynx and Xpedition Flow

Mentor Automating Design Compliance with Power-Aware Simulation HyperLynx and Xpedition Flow
by Camille Kokozaki on 02-25-2019 at 12:00 pm

High-speed design requires addressing signal integrity (SI) and power integrity (PI) challenges. Power integrity has a frequency component. The Power Distribution Network (PDN) in designs has 2 different purposes: providing power to the chip, and acting as a power plane reference for transmission-line like propagating … Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More


3D Product Design Collaboration in MCAD and ECAD Platforms

3D Product Design Collaboration in MCAD and ECAD Platforms
by Tom Dillinger on 04-25-2017 at 12:00 pm

Consumer electronics demand aggressive mechanical enclosure design — product volume, weight, shape, and connector access are all critical design optimization criteria. Mechanical CAD (MCAD) software platforms are used by product engineers to develop the enclosure definition — the integration of the PCB design… Read More


Automation for managed system-of-systems design

Automation for managed system-of-systems design
by Don Dingee on 10-26-2016 at 4:00 pm

Anybody who has done any bus & board system design knows the problem. Merchant boards typically have standardized pinouts (after years of haggling in standards organizations) for the backplane bus, and a group of user-defined pins for daughtercard I/O. Homegrown systems usually have a just-as-carefully defined proprietary… Read More


Rigid-Flex Cabling is Cool! (and requires unique EDA support)

Rigid-Flex Cabling is Cool! (and requires unique EDA support)
by Tom Dillinger on 08-15-2016 at 10:00 am

The three F’s of electronic product development are: form, fit, and function. Although the F/F/F assessment typically refers to the selection of the right component, it most definitely also refers to the selection of the proper cabling between assemblies. The requirements for cables are varied, and demanding: ability… Read More


Pathfinding to an Optimal Chip/Package/Board Implementation

Pathfinding to an Optimal Chip/Package/Board Implementation
by Tom Dillinger on 02-04-2016 at 4:00 pm

A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More


Chips and pins and layers within

Chips and pins and layers within
by Don Dingee on 03-25-2015 at 3:00 pm

After teams sweat the details of SoC and industrial design, they turn to printed circuit board designers for magic. Here are a pile of chips and passives, and a schematic for interconnecting them. This is how much physical space the board can occupy. Connectors have to be here, and here, and mounting holes there, and there. There … Read More