SoC Verification Flow and Methodologies

SoC Verification Flow and Methodologies
by Sivakumar PR on 08-18-2022 at 6:00 am

Electronic System

We need more and more complex chips and SoCs for all new applications that use the latest technologies like AI. For example, Apple’s 5nm SoC A14 features 6-core CPU, 4 core-GPU and 16-core neural engine capable of 11 trillion operations per second, which incorporates 11.8 billion transistors, and AWS 7nm 64-bit Graviton2 custom… Read More


Compute at the Edge

Compute at the Edge
by Bernard Murphy on 05-01-2019 at 7:00 am

At first glance, this seems like a ho-hum topic- just use whatever Arm or RISC-V solution you need – but think again. We’re now expecting to push an awful lot of functionality into these edge devices. Our imaginations don’t care about power, performance and cost; everything should be possible so let’s keep adding cool features.… Read More


A Turnkey Platform for High-Volume IoT

A Turnkey Platform for High-Volume IoT
by Bernard Murphy on 04-12-2018 at 7:00 am

Innovation in smart homes, smart buildings, smart factories and many other contexts differentiates in sensing, in some cases actuation, implementation certainly (low power for example) and rolling up data to the cloud. It isn’t in the on-board CPU and I doubt any of those entrepreneurs want to create their own Bluetooth or Wi-Fi… Read More


Bluetooth 5 IP is Ready for SoC Integration

Bluetooth 5 IP is Ready for SoC Integration
by Eric Esteve on 08-28-2017 at 7:00 am

Bluetooth®, WiFi, LTE, and 5G technologies enable wireless connectivity for a range of applications. While each offer unique features and advantages, designers need now to decide which protocol to integrate in a single chip after having test the market by using wireless off-chip solutions. Bluetooth 5 builds upon the success… Read More


Why Integrate Bluetooth LE IP in a Single Wearable SoC?

Why Integrate Bluetooth LE IP in a Single Wearable SoC?
by Eric Esteve on 10-20-2016 at 12:00 pm

Did you know that, in over 800 teardowns of mobile and wearable products from 2012 to 2015, wireless chips outnumbered the actual number of products, indicating multiple wireless ICs in some designs ([SUP]1[/SUP])? It could be interesting to look at the advantages of integrating wireless technology such as Bluetooth low energy… Read More


Webinar from CEVA: Machine Type Communication

Webinar from CEVA: Machine Type Communication
by Eric Esteve on 03-07-2016 at 7:00 am

By 2020, ABI Research predicts that there will be more than 45 billion connected devices worldwide. More than half of these devices will incorporate multiple standards in the same device, such as Wi-Fi, 802.15.4g, GNSS and cellular communications.

This webinar will address the question: How To Design a LTE-Based M2M Asset TrackerRead More


Why Connect to the Cloud with Atmel SMART SAM W25?

Why Connect to the Cloud with Atmel SMART SAM W25?
by Eric Esteve on 12-15-2015 at 4:00 pm

Atmel SMART SAM W25 is in fact a module, Atmel names it “SmartConnect Module”. As far as I am concerned I like SmartConnect designation and I think it could be used to describe any IoT edge device. The device is “smart” as it includes a processing unit, in this case ARM Cortex M0 based SAMD21G, and “connect” remind the Internet part of… Read More


CEVA Royalty Revenues in 2015 Supports Future IoT Design Win

CEVA Royalty Revenues in 2015 Supports Future IoT Design Win
by Eric Esteve on 12-07-2015 at 7:00 am

DSP IP addressing modem for the mobile phone market is still the flagship product and CEVA enjoys design-win at major semiconductor account (one of them being vertical and also selling the smartphone), but the acquisition of Riviera Waves in 2014 has been a strong sign of diversification. CEVA’ port-folio includes signal processing… Read More


CEVA in More than 6 Billion Chips!

CEVA in More than 6 Billion Chips!
by Daniel Nenni on 08-05-2015 at 8:00 pm

One of the IP companies that I track is CEVA, the largest licensor of DSP cores. CEVA is the fifth largest IP company behind ARM, Synopsys, Imagination Technologies, and Cadence (Lattice acquired Silicon Image). CEVA is actually a combination of companies which started with the DSP Group and Parthus Technologies in 2002 and RiveriasWaves… Read More


Apple Watch – A Great New Design, Needs More

Apple Watch – A Great New Design, Needs More
by Pawan Fangaria on 07-06-2015 at 7:00 pm

During 52[SUP]nd[/SUP] DAC, there was a special session where a brand new Apple watch was opened and each of its components was shown with a brief description about it. I found this tear down session a great innovative idea coming from DAC organizers; actually two buzzing products, AppleWatch and DJI’s Phantom Drone were opened… Read More