Webinar: How Data Rates Doubled, and Where Validation Reaches Its Limit

Webinar: How Data Rates Doubled, and Where Validation Reaches Its Limit
by Admin on 04-13-2026 at 11:27 pm

Data rates have doubled, but validation methods have not kept pace. As PCIe, DDR, and multi-terabit optical interconnects evolve, engineers are encountering signal integrity challenges much earlier in the design process.

Join Niels Fache, Senior Vice President and General Manager of Design Engineering Software at Keysight,… Read More


Webinar: HDI Design Workflow: From Decisions to Fabrication

Webinar: HDI Design Workflow: From Decisions to Fabrication
by Admin on 04-13-2026 at 11:25 pm

Ensure fabrication success with proven HDI design techniques and real-world tools.

Overview:

As AI accelerators and edge compute modules push PCB densities to their physical limits, HDI design has become the defining skill separating production-ready boards from layouts that fail at fabrication. This webinar walks through

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Webinar: Application-Specific Processors (ASIPs) for Physical AI

Webinar: Application-Specific Processors (ASIPs) for Physical AI
by Admin on 04-13-2026 at 10:12 pm

Physical AI is increasingly popular in applications requiring real-time decision making and autonomous operation.  Different from NPUs for cloud platforms, Physical AI processors can be made application-specific.  By jointly tuning their ISA and memory architecture to the network models required by the application, power

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Webinar: Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis

Webinar: Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis
by Admin on 04-09-2026 at 7:32 pm

In this webinar, Marvell will present how its team accelerates passive interposer routing for advanced 2.5D/3.5D multi die designs by bringing early, physics based signal integrity feedback into each routing iteration. Rather than relying on repeated, compute intensive 3D FEM cycles during development, Marvell uses a Method… Read More


Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal

Webinar: Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal
by Admin on 04-08-2026 at 12:53 pm

As semiconductors continue to scale, designers are turning to 3DIC architectures to meet increasing demands for performance, energy efficiency, and functional density in data centers and edge AI applications. However, stacking multiple dies introduces new multiphysics challenges including electrical, structural, and… Read More


Webinar: Understanding UALink Architecture: A Protocol Deep Dive

Webinar: Understanding UALink Architecture: A Protocol Deep Dive
by Admin on 03-31-2026 at 11:55 pm

As AI workloads scale into the thousands of accelerators and hundreds of terabytes of distributed memory, traditional interconnects cannot deliver the deterministic latency, bandwidth efficiency, or memory semantic operations required for modern training clusters. UALink provides a purpose built accelerator fabric

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Intelligent Networks: Power, Reliability, and Maintenance in Telecom — Webinar Preview

Intelligent Networks: Power, Reliability, and Maintenance in Telecom — Webinar Preview
by Daniel Nenni on 02-19-2026 at 2:00 pm

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The upcoming webinar “Intelligent Networks: Power, Reliability, and Maintenance in Telecom” will focus on how telecommunications networks are adapting to growing demands for efficiency, resilience, and scalability. As telecom operators expand 5G deployments, integrate cloud-native architectures, and prepare for AI-driven… Read More


Live Webinar: Considerations When Architecting Your Next SoC: NoC with Arteris and Aion Silicon

Live Webinar: Considerations When Architecting Your Next SoC: NoC with Arteris and Aion Silicon
by Daniel Nenni on 11-27-2025 at 8:00 am

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The explosive growth of AI and accelerated computing is placing unprecedented demands on system-on-chip (SoC) design. Modern AI workloads require extremely high bandwidth, ultra-low latency, and energy-efficient data movement across increasingly heterogeneous architectures. As SoCs scale to incorporate clusters of… Read More


Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICs

Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICs
by Mike Gianfagna on 09-11-2025 at 10:00 am

Webinar Preview – Addressing Functional ECOs for Mixed Signal ASICs

An engineering change order, or ECO in the context of ASIC design is a way to modify or patch a design after layout without needing to re-implement the design from its starting point. There are many reasons to use an ECO strategy. Some examples include correcting errors that are found in post-synthesis verification, optimizing … Read More


WEBINAR: Functional ECO Solution for Mixed-Signal ASIC Design

WEBINAR: Functional ECO Solution for Mixed-Signal ASIC Design
by Daniel Nenni on 09-04-2025 at 8:00 am

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This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs.

The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More