TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B. Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More
The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!
“The First Annual Chiplet… Read More
Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More
One of my favorite events is just around the corner and that is the TSMC OIP Ecosystem Forum and it’s at my favorite Silicon Valley venue the Santa Clara Convention Center. Nobody knows more about the inner workings of the ecosystem than TSMC so this is the premier semiconductor collaboration event, absolutely.
In my 40 years as a … Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).
One of the topics that L.C. … Read More
TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum. The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC. This article summarizes the highlights of the TSMC keynote from… Read More
The 32nd VLSI Design/CAD Symposium just occurred in a virtual setting. The theme of the event this year was “ICs Powering Smart Life Innovation”. There were many excellent presentations across analog & RF, EDA & testing, digital & system, and emerging technology. There were also some excellent keynotes, and this… Read More
Tony Pialis is a visionary entrepreneur focused on developing
technologies for next generation connectivity. In the last twenty 20 years, he has co-founded three semiconductor IP companies, all exclusively targeting connectivity IP. Tony is currently the CEO of Alphawave IP Inc, a leader in delivering multi-standard wireline… Read More
At the recent TSMC OIP Ecosystem Forum and Technology virtual events, TSMC re-affirmed their previous prediction that 5G is going to be a multi-year silicon mega-trend with the biggest drivers being the ramp up of 5G handsets, supporting infrastructure and the continued growth of high performance computing (HPC).
We all want… Read More
Recently, TSMC held their 26th annual Technology Symposium, which was conducted virtually for the first time. This article is the last of three that attempts to summarize the highlights of the presentations. This article focuses on the technology design enablement roadmap, as described by Cliff Hou, SVP, R&D.
Key Takeaways… Read More
