Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin

Podcast EP184: The History and Industry-Wide Impact of TSMC OIP with Dan Kochpatcharin
by Daniel Nenni on 09-27-2023 at 2:00 pm

Dan is joined by Dan Kochpatcharin, Dan joined TSMC in 2007. Prior to his current role heading up the Design Infrastructure Management Division, Dan led the Japan customer strategy team, the technical marketing and support team for the EMEA region in Amsterdam and was a part of the team leading the formation of the TSMC Open Innovation… Read More


The TSMC OIP Backstory

The TSMC OIP Backstory
by Daniel Nenni on 09-18-2023 at 6:00 am

TSMC OIP 2023

This is the 15th anniversary of the TSMC Open Innovation Platform (OIP). The OIP Ecosystem Forum will kick off on September 27th in Santa Clara, California and continue around the world for the next two months in person and on-line in North America, Europe, China, Japan, Taiwan, and Israel. These are THE most attended semiconductor… Read More


TSMC Clarified CAPEX and Revenue for 2023!

TSMC Clarified CAPEX and Revenue for 2023!
by Daniel Nenni on 06-06-2023 at 2:00 pm

TSMC HQ Taiwan

TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B.  Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More


Who will Win in the Chiplet War?

Who will Win in the Chiplet War?
by Daniel Nenni on 01-16-2023 at 6:00 am

Chiplet APEC

The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!

“The First Annual Chiplet… Read More


Achieving 400W Thermal Envelope for AI Datacenter SoCs

Achieving 400W Thermal Envelope for AI Datacenter SoCs
by Kalar Rajendiran on 12-05-2022 at 10:00 am

Alchip BlockDiagram Oct 26 2022 tsmc na oip presentation

Successful ASIC providers offer top-notch infrastructure and methodologies that can accommodate varied demands from a multitude of customers. Such ASIC providers also need access to best-in-class IP portfolio, advanced packaging and test capabilities, and heterogeneous chiplet integration capability among other things.… Read More


TSMC 2022 Open Innovation Platform Ecosystem Forum Preview

TSMC 2022 Open Innovation Platform Ecosystem Forum Preview
by Daniel Nenni on 10-14-2022 at 6:00 am

image002 2

One of my favorite events is just around the corner and that is the TSMC OIP Ecosystem Forum and it’s at my favorite Silicon Valley venue the Santa Clara Convention Center. Nobody knows more about the inner workings of the ecosystem than TSMC so this is the premier semiconductor collaboration event, absolutely.

In my 40 years as a … Read More


Design Technology Co-Optimization for TSMC’s N3HPC Process

Design Technology Co-Optimization for TSMC’s N3HPC Process
by Tom Dillinger on 11-02-2021 at 8:00 am

N3HPC performance comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum.  An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link).

One of the topics that L.C. … Read More


Highlights of the TSMC Open Innovation Platform Ecosystem Forum

Highlights of the TSMC Open Innovation Platform Ecosystem Forum
by Tom Dillinger on 11-01-2021 at 8:00 am

N3 comparison

TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem forum.  The talks included a technology and design enablement update from TSMC, as well as specific presentations from OIP partners on the results of recent collaborations with TSMC.  This article summarizes the highlights of the TSMC keynote from… Read More


TSMC Explains the Fourth Era of Semiconductor – It’s All About Collaboration

TSMC Explains the Fourth Era of Semiconductor – It’s All About Collaboration
by Mike Gianfagna on 08-13-2021 at 6:00 am

TSMC Explains the Fourth Era of Semiconductor – Its All About Collaboration

The 32nd VLSI Design/CAD Symposium  just occurred in a virtual setting. The theme of the event this year was “ICs Powering Smart Life Innovation”. There were many excellent presentations across analog & RF, EDA & testing, digital & system, and emerging technology. There were also some excellent keynotes, and this… Read More


CEO Interview: Tony Pialis of Alphawave IP

CEO Interview: Tony Pialis of Alphawave IP
by Daniel Nenni on 12-04-2020 at 10:00 am

Tony Pialis Alphawave on SemiWiki

Tony Pialis is a visionary entrepreneur focused on developing
technologies for next generation connectivity. In the last twenty 20 years, he has co-founded three semiconductor IP companies, all exclusively targeting connectivity IP. Tony is currently the CEO of Alphawave IP Inc, a leader in delivering multi-standard wireline… Read More