Daniel is joined by Robert Kruger, product management director at Synopsys, where he oversees IP solutions for multi-die designs, including 2D, 3D, and 3.5D topologies. Throughout his career, Robert has held key roles in product marketing, business development, and roadmap planning at leading companies such as Intel, Broadcom,… Read More
AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering: why focus on PCIe 5.0, eight years after its release? With the industry buzzing about Edge AI, cloud computing, and … Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
In a rapidly evolving semiconductor landscape, where AI demands unprecedented computational power and efficiency, Synopsys has deepened its partnership with TSMC to pioneer advancements in AI-driven designs and multi-die systems. Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages … Read More
At the AI Infra Summit 2025, Synopsys showed how artificial intelligence has become inseparable from the process of creating advanced silicon. The company’s message was clear: AI is an end-to-end engine that drives every phase of chip development. Three Synopsys leaders illustrated this from distinct vantage points. Godwin… Read More
Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More
At the AI Infra Summit 2025 was a panel conversation that captured the semiconductor industry’s anxieties and hopes. The session, titled “The Impact of AI on Semiconductor Startups,” examined how artificial intelligence is transforming not just what chips can do, but how we design them.
The backdrop is stark. Developing a leading-edge… Read More
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Edge AI systems increasingly require on-chip integration of large-capacity memory, compute engines, and inference-optimized accelerators—all within strict power, latency, and footprint constraints. This webinar provides a an overview of IP architecture and integration methodologies that support… Read More
