3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More
At IEDM in 2015 I had a chance to sit down with Subramani (Subi) Kengeri and get a briefing on GLOBALFOUNDRIES 22FDX technology. At IEDM 2016 Rick Carter of GLOBALFOUNDRIES presented a paper on 22FDX. Following Rick’s presentation, I had a chance to sit down with Rick and John Pellerin, VP of Technology and Integration and … Read More
2016 will be another defining year for semiconductors and it all starts with the Industry Strategy Symposium in Half Moon Bay next week. If you have not attended one of these you should definitely put it on your bucket list. Not only do you get to hang out in a five star cliff side resort, you get to mingle with semiconductor royalty and… Read More
