In this previous article, I was suggesting that certain chip makers may take a serious look at a disruptive way to look at Moore’s law, as they may get better ROI, profit and even better revenue. The idea is to select technology node and packaging technique in order to optimize the Price, Performance, Power triptych and manage chip… Read More
This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.
The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More
I came across an interesting white-paper from ST Ericsson on two topics: multi-processors in mobile platforms and FD-SOI. FD-SOI is the ST Microelectronics alternative to FinFETs for 20nm and below. It stands for Fully-Depeleted Silicon-on-Insulator. But I’m going to save that part of the white-paper for another blog… Read More
If we look back in the early 90’s, when the Global System for Mobile Communication (GSM) standard was just an emerging technology, the main innovation was the move from Analog to the Digital Processing of the Signal (DSP), allowing to make unlimited manipulation to an Analog signal, once digitized by the means of a converter (ADC).… Read More
Looking at the ARM Top Ten customers list (for 2010) brings useful information about the volumes production generated by the chip makers involved in the wireless handset segment. Revenue for an ARM licensee comes from upfront license and royalties. Upfront license are in the few $ million range (max), when the below listed contribution… Read More
With worldwide annual media tablet shipments forecast changing –growing- almost every quarter, the latest from ABI research calling for shipment to approach 100 million units in 2012 and passing 150 million in 2014, with the same kind of forecast for smartphone passing 400 million units this year (438 million) and approaching… Read More
DFM closure is a growing issue these days even at the 45nm node, and IC designers at ST-Ericsson have learned that transitioning from dummy fill to SmartFill has saved them time and improved their DFM score.