Keysight Showcases AI-Ready EDA and Multi-Physics Innovation at #62DAC
Design engineers attending #62DAC who focus on Design Data & IP Management, Analog, Mixed-Signal, RFIC, MMIC, or Multi-Physics should make booth #1408 a top destination. I had the opportunity to speak with Simon Rance, General Manager & Business… Read More
Breker Verification Systems Plans Demonstrations of its Complete Synthesis and SystemVIP Library and Solutions Portfolio
Attendees who step into the Breker Verification Systems booth during DAC (Booth #2520—second floor) will see demonstrations of its Trek Test Suite Synthesis and SystemVIP libraries and solutions portfolio.… Read More
When Apple introduced Siri in 2011, it was the first serious attempt to make voice interaction a mainstream user interface. Embedded into the iPhone 4S, Siri brought voice into consumers’ lives not as a standalone product, but as a built-in feature—a hands-free way to interact with an existing device. Siri set the expectation… Read More
Tell us a little bit about yourself and your company.
I am the Chief Strategy Officer at proteanTecs where I oversee our organic and inorganic growth strategies, as well as our go-to-market. This includes collaboration with ecosystem partners, defining our business model, and creating value for our customers through a targeted… Read More
As chip design complexity increases, integration scales expand and time-to-market pressures grow, as a result, design verification has become increasingly challenging. In multi-FPGA environments, the complexity of design debugging and verification further escalates, making it difficult for traditional debugging methods… Read More
SmartDV’s presence at 61st DAC centers on connections, support, and the human side of IP. Over the past 18 months, we have been laser-focused on focused on overhauling and streamlining our customer support model to provide our global IP users with the best possible service. Vice President of Application Engineering Sergio Marchese… Read More
Subsystem and full-chip integration plays a crucial role in any project – particularly for large SoCs. Our upcoming webinar on April 30 confronts the typical challenges of this process and provides a detailed view into how IP centric design can help you solve them. Join us to learn how transforming your design flow can help your… Read More
No doubt that the design success of nowadays system on chips (SoCs) is directly linked to the success of cost control. More market opportunities are open for less expensive system on chips and electronic systems.
Both the design cost prediction and the resource tracking during the design process, are key to such a success
Predicting… Read More
As embedded systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these embedded applications must be efficient to deliver high levels of performance within limited power… Read More
3D-ICs bring together multiple silicon dies into a single package that’s significantly larger and complex than traditional systems on a chip (SoCs). There’s no doubt these innovative designs are revolutionizing the semiconductor industry.
3D-ICs offer a variety of performance advantages over traditional SoCs. Because … Read More
