Yesterday Cadence had an all-day Signoff Summit where they talked about the tools that they have for signoff in advanced nodes. Well, of course, those tools work just fine in non-advanced nodes too, but at 20nm and 16nm there are FinFETs, double patterning, timing impacts from dummy metal fill, a gazillion corners to be analyzed… Read More
I had time for lunch on Monday. That is to say, there was a Cadence panel session about Has Timing Signoff Innovation has become and Oxymoron? What Happened and How Do We Fix It?
The moderator was Brian Fuller, lately of EE Times but now Editor-in-Chief at Cadence (I’m not sure quite what it means either). On the panel were Dipesh… Read More
Today Atrenta and Mentor announced that they were collaborating to enable accurate, signoff quality power estimation at the RTL for entire SoCs. The idea is to facilitate RTL power estimation for designs of over 50M gates running actual software loads over hundreds of millions of cycles, resulting in simulation datasets in the… Read More
We have talked for years about RTL signoff, the idea that a design could be finalized at the RTL level and then most of the signoff would take place there. Then the design would be passed to a physical implementation team who would not expect to run into any problems (such as routing congestion, missing the power budget or similar problems).… Read More
Today Cadence announced Tempus, their new timing signoff solution. This has been in development for at least a couple of years and has been built from the ground up to be massively parallelized. Not just that different corners can be run in parallel (which is basically straightforward) but that large designs can be partitioned … Read More
Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More
