Tag: signal

2022 R2: What’s New in Ansys Signal & Power Integrity

2022 R2: What’s New in Ansys Signal & Power Integrity
by Admin on 08-09-2022 at 8:00 am

Learn about the latest updates and newest functionality in Ansys Signal and Power Integrity. This webinar will describe the new features & capabilities of Ansys SIwave in detail, including new workflows for bending PCBs and creating encrypted 3D layouts.

Time:
August 9, 2022
11 am EST

Venue:
Virtual

About this Event

The 2022

… Read More

Keysight Talks Standards: Bluetooth Low Energy with PathWave Signal Generation Webinar

Keysight Talks Standards: Bluetooth Low Energy with PathWave Signal Generation Webinar
by Admin on 02-10-2022 at 10:00 am

Date: Thursday February 10, 2022
Time: 10:00 AM PT / 1:00 PM ET
Duration: 30 minutes

Learn More on Bluetooth Low Energy!

In this webinar, Brad Jolly gives an overview on what is new to Bluetooth Low Energy standard while also providing an update for features such as Profiles, Qualification Testing, and Cybersecurity. … Read More

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Mentor’s Symphony in Tune with AMS Designer Needs

Mentor’s Symphony in Tune with AMS Designer Needs
by Tom Simon on 11-14-2018 at 12:00 pm
Categories: EDA, Siemens EDA

Mixed signal simulation is a very hot topic these days. In modern designs, it is harder to draw a line between the analog and digital and work with them independently. Analog blocks are showing up everywhere. Even in what would have qualified as a digital design a few years ago, now designers need to look at things like PLLs, IOs and … Read More

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Simulating ADAS

Simulating ADAS
by Bernard Murphy on 05-04-2017 at 7:00 am
Categories: Ansys, Inc., Automotive, EDA, IoT

Simulation is a broad technique spanning certainly digital logic and circuit simulation but also methods beyond these which are particularly relevant to ADAS design. In fact, much of the design of full ADAS systems begins and ends with these types of modeling. This is in part due to the need fully validate integrity and reliability… Read More

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Power, Signal, Thermal and EMI signoff

Power, Signal, Thermal and EMI signoff
by Paul McLellan on 08-28-2012 at 1:55 pm
Categories: Ansys, Inc., EDA
3 Comments

Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More

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Challenges in 3D-IC and 2½D Design

Challenges in 3D-IC and 2½D Design
by Paul McLellan on 12-09-2011 at 5:18 pm
Categories: Ansys, Inc., EDA

3D IC design and what has come to be known as 2½D IC design, with active die on a silicon interposer, require new approaches to verification since the through silicon vias (TSVs) and the fact that several different semiconductor processes may be involved create a new set of design challenges

The power delivery network is a challenge… Read More