Analog Bits, Inc. is an established provider of mixed-signal semiconductor IP that integrates into advanced system-on-chip (SoC) designs to enable intelligent energy and power management. Its full portfolio of IP blocks includes precision clocking macros, power and temperature sensors including LDO and regulators, programmable… Read More
Tag: serdes
Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?
The semiconductor landscape is currently undergoing a structural transformation as the “Data-Centric Shift” moves the industry’s center of gravity from smartphones toward High-Performance Computing (HPC) and AI infrastructure.
This transition is clearly validated by TSMC’s 2025 filings, which show… Read More
The Packaging PDK Is the Missing Layer for Co-Packaged Optics
From Photonic Device Design to Electro-Optical Realization
Co-packaged optics will not scale through photonic device performance alone.
As AI infrastructure pushes bandwidth, power, latency, and reach to new limits, optics is moving closer to the compute engine. The industry is no longer asking only whether a photonic device… Read More
MIPI Alliance Accelerates Automotive AI Connectivity with A-PHY Compliance Program
The automotive semiconductor industry is undergoing a major architectural transition as vehicles evolve into centralized, software-defined computing platforms capable of supporting advanced driver assistance systems (ADAS), autonomous driving, and AI-enabled cockpit applications. This shift is driving demand for… Read More
Smarter IC Layout Parasitic Analysis
IC layout parasitics dominate the performance of custom digital, analog and mixed-signal designs, so the challenge becomes how to identify the root causes and to quantify the effects of parasitics during early design stages. The old method of iterating between layout, extraction, SPICE simulation, followed by manual debug… Read More
AI Booming is Fueling Interface IP 23.5% YoY Growth
AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More
Silicon Creations is Fueling Next Generation Chips
Next generation semiconductor design puts new stress on traditionally low-key parts of the design process. One example is packaging, which used to be the clean-up spot at the end of the design. Thanks to chiplet-based design, package engineers are now rock stars. Analog design is another one of those disciplines.
Not long ago,… Read More
CEO Interview: Bijan Kiani of Mach42
Bijan’s role includes overseeing all product groups, field engineering, customer support, strategy, sales, marketing, and business development. His previous appointments include VP of Marketing at Synopsys Design Group and CEO of InCA. He holds a PhD in Electrical Engineering.
Tell us about your company
Mach42 is a verification… Read More
Empowering AI, Hyperscale and Data Center Connectivity with PAM4 SerDes Technology
The rapid expansion of data-intensive applications, such as artificial intelligence (AI), high-performance computing (HPC), and 5G, necessitates connectivity solutions capable of handling massive amounts of data with high efficiency and reliability. The advent of 224G/112G Serializer/Deserializer (SerDes) technology,… Read More
Will my High-Speed Serial Link Work?
PCB designers can perform pre-route simulations, follow layout and routing rules, hope for the best from their prototype fab, and yet design errors cause respins which delays the project schedule. Just because post-route analysis is time consuming doesn’t mean that it should be avoided. Serial links are found in many PCB designs,… Read More
