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The 15th TSMC Open Innovation Platform® (OIP) event was held recently. This event is a focal point across the industry for cutting-edge development and industry-level collaboration. Appropriately, advanced packaging, paving the way for multi-die design was a focal point for the event. You can get a good overview of what was … Read More
Last year, I said that the launch of ARC based complete sound system IP by Synopsys ring the bell for the opening of a new IP market segment, the “Subsystem IP”. This week, Synopsys has announced the availability of the DesignWare® Sensor IP Subsystem, a complete and integrated hardware and software solution for sensor control applications.… Read More
