ISTFA
Silicon Valley is a great location for trade shows and technical conferences, so if you have an interest in test and failure analysis then don’t miss out on the 37th annual International Symposium for Testing and Failure Analysis. This year ISTFA will be held from Sunday, November 13th thru Thursday, November 17th … Read More
This was my first ARM TechCon, they cordially invited me as media, but it certainly was not what I expected. Making matters worse, I had literally just flown in from a very long weekend sailing in Mexico which was much more interesting and certainly made me much less tolerant of sales and marketing nonsense. My Uncle Jim lives on a sailboat… Read More
I’ve blogged about the Calibre family of IC design tools before:
Smart Fill replaced Dummy Fill Approach in a DFM Flow
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
SICAS (Semiconductor Industry Capacity Statistics) has released its 2Q 2011 data with significant changes in membership. The data is available through the SIA at: SICASdata The SICAS membership list no longer includes the Taiwanese companies Nanya Technology, Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) or United… Read More
Vertical integration, as I have noted in previous blogs, is the way to domination and maximum profitability. That is unless someone else has beaten you to the punch with an even bettermodel. Apple is now executing a product and manufacturing supplier strategy that will force Samsung to lose lots of money and then ultimately split… Read More
EDA companies and foundries must closely collaborate in order to deliver IC tool flows that work without surprises at the 40nm and 28nm nodes.
Tomorrow in San Jose you can attend this 4th annual event hosted by TSMC along with Mentor Graphics and other EDA and IP companies.
Here are some of the topics that will interest IC designers… Read More
In case you have not heard, the 16th Si2-hosted conference highlighting industry progress in design flow interoperability comes to Silicon Valley (Santa Clara, CA) on October 20th. Si2Con will showcase recent progress of members in the critical areas of:
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Will Rogers said that an economist’s guess is liable to be as good as anyone’s, but with advanced-node optical lithography, I might have to disagree. Unlike the fickle economy, the distorting effects of the mask and lithographic system are ruled by physics, and so can be modeled.
In this installment, I’ll talk about two critical… Read More
Memory designers need to predict the timing, current and power of their designs with high accuracy before tape-out to ensure that all the design goals will be met. Extracting the parasitic values from the IC layout and then running circuit simulation is a trusted methodology however the accuracy of the results ultimately depend… Read More
Apple will purchase close to eightBILLION dollars in parts from Samsung for the iSeries of products this year alone, making Apple Samsung’s largest customer. Samsung is also Apple’s largest competitor and TSMC’s most viable competitive foundry threat so it was no surprise to see Apple and TSMC team up on the next generations of… Read More
