Semicap Thoughts: ASML AMAT INTEL SAMSUNG TSMC MICRON

Semicap Thoughts: ASML AMAT INTEL SAMSUNG TSMC MICRON
by Robert Maire on 07-27-2017 at 12:00 pm

ASML reported results in line and slightly ahead of expectations which helped push ASML and the other semicap stocks back to their original valuations prior to the two step pull back that lasted about a month. We are now back to relatively high, record valuations not seen or ever seen previously (at least for a long time) by many companies.… Read More


SEMICON Southeast Asia reflects strong equipment market

SEMICON Southeast Asia reflects strong equipment market
by Bill Jewell on 04-28-2017 at 4:00 pm

SEMICON Southeast Asia was held this week in Penang, Malaysia. Over 6500 people attended the conference to learn about the latest trends and equipment in semiconductor manufacturing.


Dr. Dan Tracy, Senior Director Industry Research and Statistics at SEMI, presented an optimistic outlook for the semiconductor equipment market… Read More


Lam beats on EPS & Revs and good Q1 (Sept) guide

Lam beats on EPS & Revs and good Q1 (Sept) guide
by Robert Maire on 08-10-2016 at 7:00 am

Continues to Outgrow in a Flat Capex Environment. Is September the 2016 Peak with a softer December? Lam reported June, Q4 , revenues of $1.55B and EPS of $1.80, handily beating estimates and besting relatively high expectations for a positive spin and outlook for H2. Guidance was for a Sept quarter of $1.625B in revs and $1.77 in Read More


3D NAND – Moore’s Law in the third dimension

3D NAND – Moore’s Law in the third dimension
by Scotten Jones on 05-07-2016 at 4:00 am

For more than a decade 2D NAND has been the leading driver of lithography shrinks, for example, Samsung went from 120nm in 2003 to 16nm in 2014 with shrinks on an almost yearly basis, but the shrinks came at a price. At 16nm Self Aligned Quadruple Pattering (SAQP) was required for the most critical layers and patterning related costs… Read More


Semiconductor capital spending slow in 2016

Semiconductor capital spending slow in 2016
by Bill Jewell on 05-01-2016 at 12:00 pm

The outlook for semiconductor capital expenditures (capex) in 2016 is weak. Gartner’s January 2016 forecast called for a decline of 4.7%. IC Insights in February projected a 0.8% decline. The table below shows the Gartner forecast along with the capex forecasts from the top three spenders (Intel, Samsung and TSMC) which… Read More


How China can Lead in the Semiconductor Industry

How China can Lead in the Semiconductor Industry
by Pawan Fangaria on 03-06-2016 at 8:00 pm

Since a few years China has been very aggressive in acquiring semiconductor companies around the world. Last year, Chinese government along with PE (Private Equity) and other investors in China announced an ambitious plan under which more than $150 billion were to be invested over next 5 to 10 years in developing semiconductor… Read More


Pure-play Foundries to Prevail in Future

Pure-play Foundries to Prevail in Future
by Pawan Fangaria on 01-17-2016 at 7:00 am

In a consolidating semiconductor business environment and innovation in semiconductor fabrication already scaling new heights with existing strong players, where do you think the wafer capacity should concentrate? It’s pure-play foundries or pure-play-like foundries, and those who supply high-volume common components… Read More


IEDM Blogs – Part 5 – Intel and Micron 3D NAND

IEDM Blogs – Part 5 – Intel and Micron 3D NAND
by Scotten Jones on 12-29-2015 at 7:00 am

At IEDM Intel and Micron presented “A Floating Gate Based 3D NAND Technology With CMOS Under Array” authored by Krishna Parat and Chuck Dennison.

As I previously discussed in my blog on the IEDM memory short course and blog on IMEC’s work on high mobility 3D NAND channels, continuing to scale 2D Flash has become extremely difficult… Read More


IEDM Blogs – Part 4 – IMEC InGaAs Channel for 3D NAND

IEDM Blogs – Part 4 – IMEC InGaAs Channel for 3D NAND
by Scotten Jones on 12-28-2015 at 4:00 pm

At IEDM IMEC presented “MOCVD In[SUB]1-x[/SUB]Ga[SUB]x[/SUB]As high mobility channel for 3-D NAND Memory” authored by E. Capogreco, J. G. Lisoni, A. Arreghini, A. Subirats, B. Kunert, W. Guo, T. Maurice, C.-L. Tan, R. Degraeve, K. De Meyer, G. Van den bosch, and J. Van Houdt.

On December 15[SUP]th[/SUP] I had the opportunity … Read More


Micron Misses (MU) – No surprise – Needs focus on NAND/XPoint not diving DRAM

Micron Misses (MU) – No surprise – Needs focus on NAND/XPoint not diving DRAM
by Robert Maire on 12-26-2015 at 12:00 pm

We are surprised that everyone is surprised at DRAM, DRAM oversupply/weak demand is systemic so Micron needs to focus on NAND/XPoint.We find it somewhat amusing that many “analysts” were caught off guard about the weakness in Microns results and poor guidance. Why would you think DRAM would be OK???…Have Read More