Continues to Outgrow in a Flat Capex Environment. Is September the 2016 Peak with a softer December? Lam reported June, Q4 , revenues of $1.55B and EPS of $1.80, handily beating estimates and besting relatively high expectations for a positive spin and outlook for H2. Guidance was for a Sept quarter of $1.625B in revs and $1.77 in … Read More
Tag: micron
3D NAND – Moore’s Law in the third dimension
For more than a decade 2D NAND has been the leading driver of lithography shrinks, for example, Samsung went from 120nm in 2003 to 16nm in 2014 with shrinks on an almost yearly basis, but the shrinks came at a price. At 16nm Self Aligned Quadruple Pattering (SAQP) was required for the most critical layers and patterning related costs… Read More
Semiconductor capital spending slow in 2016
The outlook for semiconductor capital expenditures (capex) in 2016 is weak. Gartner’s January 2016 forecast called for a decline of 4.7%. IC Insights in February projected a 0.8% decline. The table below shows the Gartner forecast along with the capex forecasts from the top three spenders (Intel, Samsung and TSMC) which… Read More
How China can Lead in the Semiconductor Industry
Since a few years China has been very aggressive in acquiring semiconductor companies around the world. Last year, Chinese government along with PE (Private Equity) and other investors in China announced an ambitious plan under which more than $150 billion were to be invested over next 5 to 10 years in developing semiconductor… Read More
Pure-play Foundries to Prevail in Future
In a consolidating semiconductor business environment and innovation in semiconductor fabrication already scaling new heights with existing strong players, where do you think the wafer capacity should concentrate? It’s pure-play foundries or pure-play-like foundries, and those who supply high-volume common components… Read More
IEDM Blogs – Part 5 – Intel and Micron 3D NAND
At IEDM Intel and Micron presented “A Floating Gate Based 3D NAND Technology With CMOS Under Array” authored by Krishna Parat and Chuck Dennison.
As I previously discussed in my blog on the IEDM memory short course and blog on IMEC’s work on high mobility 3D NAND channels, continuing to scale 2D Flash has become extremely difficult… Read More
IEDM Blogs – Part 4 – IMEC InGaAs Channel for 3D NAND
At IEDM IMEC presented “MOCVD In[SUB]1-x[/SUB]Ga[SUB]x[/SUB]As high mobility channel for 3-D NAND Memory” authored by E. Capogreco, J. G. Lisoni, A. Arreghini, A. Subirats, B. Kunert, W. Guo, T. Maurice, C.-L. Tan, R. Degraeve, K. De Meyer, G. Van den bosch, and J. Van Houdt.
On December 15[SUP]th[/SUP] I had the opportunity … Read More
Micron Misses (MU) – No surprise – Needs focus on NAND/XPoint not diving DRAM
We are surprised that everyone is surprised at DRAM, DRAM oversupply/weak demand is systemic so Micron needs to focus on NAND/XPoint.We find it somewhat amusing that many “analysts” were caught off guard about the weakness in Microns results and poor guidance. Why would you think DRAM would be OK???…Have … Read More
Eliminating the Chasm of Computing
The world has come through a long way from the 1[SUP]st[/SUP] UNIVAC computer in 1952, IBM mainframes and minicomputers in secured computer rooms to laptops, tablets, mobile phones, and so on in our hands. Imagine the compute power of a minicomputer then and the compute power of your smartphone or tablet today. And do you know the… Read More
Samsung to cut Semi Capex 20% due to over capacity
Article confirms market fears…
An article in the Korea Times cites sources that say Samsung will cut Semi Capex by 20% due to current oversupply and weak pricing. This is obviously a huge negative as Capex for 2016 will certainly be down significantly from 2015 given these cuts which follow on cuts by Intel and others. We can… Read More