Most IC and system engineers follow a familiar process when designing a new product: create a model, use parameters for the model, simulate the model, observe the results, compare results versus requirements, change the parameters or model and repeat until satisfied or it’s time to tape out. On the EDA side, most tools perform… Read More
It was my pleasure to meet Veerbhan Kheterpal. Veerbhan has founded three technology companies and has full stack expertise spanning software to silicon across Edge & Datacenter applications. Currently, he is a CEO & co-founder of quadric.io, a company that has created a new processor architecture for high performance… Read More
Back in 2020 I first learned from Synopsys about how they had engineered a better way to do optimize layouts on digital designs by using machine learning techniques, instead of relying upon manual approaches. The product was named DSO.ai, standing for Design Space Optimization, and it produced a more optimal floor-plan in less… Read More
Earlier this year, Achronix made a product announcement about shipping the industry’s highest performance Speedster7t FPGA devices. The press release included lot of details about the architecture and features of the device and how that family of devices is well suited to satisfy the demands of the artificial intelligence … Read More
Electronic design automation (EDA) has come a long way from its beginnings. It has enabled chip engineers from specifying designs directly in layout format during the early days to today’s capture in RTL format. Every advance in EDA has made the task of designing a chip easier and increased the design team productivity, enabling… Read More
There’s a lot to unpack in the title of this post. First, Siemens EDA is the new name for Mentor, a Siemens Business. The organization continues to operate as part of Siemens Digital Industries Software. The organization has released a white paper that describes research done with the American University of Armenia. The work examines… Read More
In July, I explored the benefits of the new Cadence Tempus™ Power Integrity Solution. In that piece, I explored some of the unique capabilities of this new tool with Brandon Bautz, senior product management group director and Hitendra Divecha, product management director in the Digital & Signoff Group at Cadence. I recently… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. This presentation is from Alchip, presented by James Huang,… Read More
SoC verification has always been an interesting topic for me. Having worked at companies like Zycad that offered hardware accelerators for logic and fault simulation, the concept of reducing the time needed to verify a complex SoC has occupied a lot of my thoughts. The bar we always tried to clear was actually simple to articulate… Read More
DAC was full of great panels, research papers and chip design stories this year, the same as other years. Being a virtual show, there were some differences of course. I’ve heard attendance was way up, allowing a lot more folks to experience the technical program. This is likely to be true for a virtual event. I’m sure we’ll see more… Read More
