Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design

Accelerating 5G Innovation and Reliability Through Simulation and Advanced FinFET Design
by Camille Kokozaki on 02-14-2019 at 7:00 am

In an ANSYS seminar held at DesignCon 2019, Dr. Larry Williams, ANSYS Director of Technology, outlined how 5G design innovation can be accelerated through simulation. He posited that 5G will become a general-purpose technology that affects an entire economy, drastically alter societies and unleash a cascade of complementary… Read More


Webinar: Chip-Package-System Design for ADAS

Webinar: Chip-Package-System Design for ADAS
by Bernard Murphy on 04-10-2017 at 7:00 am

When thinking of ADAS from an embedded system perspective, it is tempting to imagine that system can be designed to some agreed margins without needing to worry too much about the details of the car environment and larger environment outside the car. But that’s no longer practical (or acceptable) for ADAS or autonomous systems.… Read More