Tag: icepak

Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update

Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update
by Admin on 06-21-2024 at 3:07 pm

Join us for an exclusive webinar during Ansys 2024 R2 updates. We’ll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities.

TIME:
JULY 18, 2024
11 AM EDT

Venue:
Virtual

Overview

This Ansys 2024 R2 webinar

… Read More

Ansys In-Person Training – San Jose

Ansys In-Person Training – San Jose
by Admin on 03-18-2024 at 2:28 pm

Join us for a 4-day in-person introductory training on four comprehensive simulation solutions.

  • Ansys Materials
  • Ansys Icepak
  • Ansys Lumerical
  • Ansys HFSS

Register to attend one or all four sessions. Space is limited, so sign up today to save your spot.

*Lunch will be provided for each session.

Date:
Tuesday, May 7, 2024 – Friday,… Read More

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Thermal and Reliability in Automotive

Thermal and Reliability in Automotive
by Bernard Murphy on 06-12-2018 at 7:00 am
Categories: Ansys, Inc., Automotive, EDA, FinFET
3 Comments

Thermal considerations have always been a concern in electronic systems but to a large extent these could be relatively well partitioned from other concerns. Within a die you analyze for mean and peak temperatures and mitigate with package heat-sinks, options to de-rate the clock, or a variety of other methods. At the system level… Read More

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Reliability Signoff for FinFET Designs

Reliability Signoff for FinFET Designs
by Bernard Murphy on 10-17-2017 at 7:00 am
Categories: Ansys, Inc., Automotive, EDA, TSMC

Ansys recently hosted a webinar on reliability signoff for FinFET-based designs, spanning thermal, EM, ESD, EMC and aging effects. I doubt you’re going to easily find a more comprehensive coverage of reliability impact and analysis solutions. If you care about reliability in FinFET designs, you might want to check out this webinar.… Read More

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FinFET Designs Need Early Reliability Analysis

FinFET Designs Need Early Reliability Analysis
by Pawan Fangaria on 02-19-2015 at 9:30 pm
Categories: Ansys, Inc., EDA

In a world with mobile and IoT devices driven by ultra-low power, high performance and small footprint transistors, FinFET based designs are ideal. FinFETs provide high current drive, low leakage and high device density. However, a FinFET transistor is more exposed to thermal issues, electro migration (EM), and electrostatic… Read More

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Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm
Categories: Ansys, Inc., EDA

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More