High-End Interconnect IP Forecast 2022 to 2026

High-End Interconnect IP Forecast 2022 to 2026
by Eric Esteve on 12-04-2022 at 10:00 am

TSMC Revenue by Platform 1Q22 1

The Interface IP market has grown with 21% CAGR from 2017 to 2021 and we review the part of this market restricted to the high-end of PCIe, DDR, Ethernet and D2D IP made of PHY and controller targeting the most advanced technology nodes and latest protocol release. We will show that an IP vendor focusing investment on the high-end interconnect… Read More


Alchip Technologies Offers 3nm ASIC Design Services

Alchip Technologies Offers 3nm ASIC Design Services
by Kalar Rajendiran on 07-14-2022 at 10:00 am

Alchip Design Technology Roadmap

Throughout its history, the ASIC industry has had its ups and downs. With feast and famine cycles, the ASIC business model is not for the faint of heart. Some companies tread boldly while others dread the cycles and stay away from this business model. Those who are consistently successful have to overcome many challenges thrown … Read More


Memory Bandwidth Races Higher with HBM3

Memory Bandwidth Races Higher with HBM3
by Admin on 03-03-2022 at 1:44 pm

March 15th @ 11am PT | 2pm ET

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3

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S2C’s FPGA Prototyping Solutions

S2C’s FPGA Prototyping Solutions
by Kalar Rajendiran on 02-10-2022 at 10:00 am

Logic Matrix System Configuration Table

Prototyping solutions have been in the news a lot lately. And FPGA-based prototyping approach is pretty widely used. On a panel session at DAC 2021, Amir Salek, Head of Silicon for Cloud and Infrastructure at Google had the following to say. Prototyping FPGA is a tremendous platform for testing and validation. We are doubling down… Read More


Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions

PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions
by Kalar Rajendiran on 12-15-2021 at 6:00 am

Avery PCIe Speed Adapter IP at Work

We live in the age of big data. No matter how fast and complex modern SoCs are, it all comes down to how quickly data can get in and out that determines the system performance. And, there is a lot of data that today’s systems need to process. Naturally, system interfaces such as PCIe, DDR, HBM, etc., have been evolving rapidly too, to support… Read More