The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More
Tag: hbm
Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More
Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation
The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More
Evolution of Memory Test and Repair: From Silicon Design to AI-Driven Architectures
Memory testing in the early days of computing was a relatively straightforward process. Designers relied on simple, deterministic approaches to verify the functionality of memory modules. However, as memory density increased and systems became more complex, the likelihood of faults also rose. With advancements in memory… Read More
AMAT- In line QTR – poor guide as China Chops hit home- China mkt share loss?
- QTR was just “in-line” but guide was below expectations
- We think its not just China export rules but share loss as well
- Leading edge is strong but obviously not enough to offset China
- Memory remains weak-Foundry (TSMC) is the primary driver
Headwinds slow growth to flat
Applied reported $7.166B in revenues and Non … Read More
KLAC Good QTR with AI and HBM drive leading edge and China is Okay
– KLA put up a good qtr & year with consistent growth
– AI & HBM are the main drivers of leading edge which helps KLA
– China slowing but not too fast, Outlook OK but not super
– Wafer inspection is huge but reticle inspection continues to slip
KLA reports good quarter and OK outlook
KLA reported revenues… Read More
Heterogeneous 2D/3D Packaging Challenges
A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More
ML and Multiphysics Corral 3D and HBM
3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More
Consumer memory slowing more than AI gaining
- Consumer memory slowing more than AI gaining causing weakness
- HBM sold out for 2025- HBM is most of Capex- NAND near zero
- Big miss on Q1 guide crushes stock on disappointment
- Positive for Nvidia- Negative for Broadcom/Qualcomm
Micron – AI is wonderful & growing out of bounds while consumer sucks
Micron reported in line… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More