AMAT- In line QTR – poor guide as China Chops hit home- China mkt share loss?

AMAT- In line QTR – poor guide as China Chops hit home- China mkt share loss?
by Robert Maire on 02-16-2025 at 6:00 am

Robert Maire Semiconductor Advisors
  • QTR was just “in-line” but guide was below expectations
  • We think its not just China export rules but share loss as well
  • Leading edge is strong but obviously not enough to offset China
  • Memory remains weak-Foundry (TSMC) is the primary driver
Headwinds slow growth to flat

Applied reported $7.166B in revenues and Non … Read More


KLAC Good QTR with AI and HBM drive leading edge and China is Okay

KLAC Good QTR with AI and HBM drive leading edge and China is Okay
by Robert Maire on 02-05-2025 at 6:00 am

Robert Maire Semiconductor Advisors

– KLA put up a good qtr & year with consistent growth
– AI & HBM are the main drivers of leading edge which helps KLA
– China slowing but not too fast, Outlook OK but not super
– Wafer inspection is huge but reticle inspection continues to slip

KLA reports good quarter and OK outlook

KLA reported revenues… Read More


Heterogeneous 2D/3D Packaging Challenges

Heterogeneous 2D/3D Packaging Challenges
by Daniel Payne on 01-27-2025 at 10:00 am

Innovator3D IC flow min

A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More


Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration

Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration
by Admin on 01-14-2025 at 3:31 am

Memory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications.

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ML and Multiphysics Corral 3D and HBM

ML and Multiphysics Corral 3D and HBM
by Bernard Murphy on 01-07-2025 at 6:00 am

multidie and HBM stacks min

3D design with high-bandwidth memory stacks (HBM) has become essential for leading edge semiconductor systems in multiple applications. Hyperscalers depend on large AI accelerator cores supported by 100GB or more of in-package HBM to handle trillion parameter AI models. Autonomous Drive (AD) vehicles may handle smaller … Read More


Consumer memory slowing more than AI gaining

Consumer memory slowing more than AI gaining
by Robert Maire on 12-23-2024 at 10:00 am

Micron Idaho Fabs
  • Consumer memory slowing more than AI gaining causing weakness
  • HBM sold out for 2025- HBM is most of Capex- NAND near zero
  • Big miss on Q1 guide crushes stock on disappointment
  • Positive for Nvidia- Negative for Broadcom/Qualcomm
Micron – AI is wonderful & growing out of bounds while consumer sucks

Micron reported in line… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


5 Expectations for the Memory Markets in 2025

5 Expectations for the Memory Markets in 2025
by Daniel Nenni on 10-01-2024 at 10:00 am

Expectations for the Memory Markets in 2025

TechInsights has a new memory report that is worth a look. It is free if you are a registered member which I am. HBM is of great interest and there is a section on emerging and embedded memories for chip designers. Even though I am more of a logic person, memory is an important part of the semiconductor industry. In fact, logic and memory

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Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More