A Brief History of Today’s Flexible ASIC Model

A Brief History of Today’s Flexible ASIC Model
by Daniel Nenni on 10-25-2012 at 8:10 pm

There’s been an interesting trend emerging the past couple of years; a gentrification, if you will, of the ASIC business. What was thought to be a dying supply chain model has re-emerged as a health and growing segment of the semiconductor industry. Recent figures from Gartner place 2012 ASIC revenue at around $24.4 billion… Read More


Flexible ASIC Strategy!

Flexible ASIC Strategy!
by Daniel Nenni on 04-21-2012 at 9:00 pm

During my last Taiwan trip I also spent time with Global Unichip. Clearly, in order for the semiconductor industry to thrive we must enable design starts. With the rising costs and complexity of semiconductor design and manufacturing this is a much greater challenge which is why I’m so interested in GUC, for the greater good of the… Read More


Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!

Semiconductor Packaging (3D IC) Emerging As Innovation Enabler!
by Daniel Nenni on 01-29-2012 at 4:00 pm

The ASIC business is getting more and more complicated. The ability to produce innovative die at a competitive price to solve increasingly complex problems just isn’t enough. The technology required to package that die is now front and center.

Here, at the junction of advanced design, process technology and state-of-the art … Read More


Semiconductor IP Dilemma?

Semiconductor IP Dilemma?
by Daniel Nenni on 01-01-2012 at 3:00 pm

Just how many hands have touched your SoC design by the time it goes to manufacturing? Clearly the more hands that touch it, the more complex the design is, making it more difficult to meet your product requirements. The commercial semiconductor IP dilemma is that not only are you using the same IP as your competitors, you are exponentially… Read More


Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!

Taiwan Trip Report: Semiconductors, EDA, and the ASIC Business!
by Daniel Nenni on 12-04-2011 at 7:00 pm

Just returning from my monthly trip to Taiwan and I find myself energized! Semiconductors, EDA, and the ASIC business have never been more exciting! The travel itself is not so exciting but since I make frequent trips the airline and hotel treat me like a king. And let me tell you, it is good to be a king!

Speaking of royalty, I saw Dr. Read More


TSMC ASIC versus IBM ASIC!

TSMC ASIC versus IBM ASIC!
by Daniel Nenni on 10-30-2011 at 3:00 pm

Lunch with Jim Lai, President of Global Unichip(GUC), was the highlight of my week, I had a very nice crab cake salad. As you may have read, GUC announced itself as the “Flexible ASIC Leader” taking direct aim at the traditional ASIC market led by the likes of IBM, ST Micro, TI, Renesas, and Samsung. This will be like “shooting fish inRead More


ARM TechCon 2011 Trip Report and Sailing Semiconductors!

ARM TechCon 2011 Trip Report and Sailing Semiconductors!
by Daniel Nenni on 10-26-2011 at 9:37 pm

This was my first ARM TechCon, they cordially invited me as media, but it certainly was not what I expected. Making matters worse, I had literally just flown in from a very long weekend sailing in Mexico which was much more interesting and certainly made me much less tolerant of sales and marketing nonsense. My Uncle Jim lives on a sailboat… Read More