Good news is good to hear, particularly these days! The behavior of the Design IP market in 2019 is extremely positive, when the semiconductor market has seen a decline worst than in 2009 (economy crisis) or 2001 (internet bubble collapse). Analysis this 5.2% growth in detail will help to understand the future of the IP market, as… Read More
Tag: eric esteve
#56thDAC SerDes, Analog and RISC-V sessions
The good news is that the next five DAC events will take place in Moscone Center in San Francisco! If going to Las Vegas from the Bay area is an easy trip, coming from Europe to Las Vegas makes it a 24+hours journey… One obvious consequence was the poor attendance to the exhibition floor. But let’s be positive and notice that the number… Read More
Monday DAC IP Session “PAM 4 Enable 112G SerDes”
This session will open the DAC IP Track at 10:30 on Monday “How PAM4 and DSP Enable 112G SerDes Design” in Room N264. I am very proud to chair this invited paper session, as it addresses one of the key pieces of design, enabling to exchange data flow at the highest possible data rate. It can be between two chips on the same board, we talk … Read More
USB 3.x IP Revenue Have Grown by 31% in 2017 (IPnest)
Despite the strong consolidation in the semiconductor industry, the Design IP market is going well, very well with YoY growth of 12%+ in 2017, according with the “Design IP Report” from IPnest. If we look at the Interface IP category (20% growth in 2017) and analyze the IP revenues by protocols, we can see that USB IP is amazingly healthy,… Read More
Low Cost Power NB-IoT Solution? Fusion F1 DSP based Modem!
Supporting NB-IoT requires low cost (optimized silicon footprint) and ultra-low power solution to cope with IoT device requirement. Cadence Fusion F1 DSP IP has been integrated in modem IC by two new customers, Xinyi and Rafael, gaining traction in NB-IoT market. These design-win builds on previous momentum: software GPS solution… Read More
1.2 Terabit/s C2C Interface? Only with Interlaken!
If you are familiar with high bandwidth networking applications, you probably know this chip-to-chip (C2C) interface protocol. Interlaken architecture, fully flexible, configurable and scalable, is also an elegant answer to the need for very high bandwidth C2C communication. Interlaken is elegant because the protocol … Read More
4 Reasons for Bluetooth 5 Adoption in IoT
IoT devices have to be connected but power consumption is usually a real concern. If you think about wearables, like for example fitness wristbands, the time between charges could make or break the product. Even if Wi-Fi looks attractive to connect an IoT device, the system developers have quickly realize that the power consumption… Read More
Submerging the Data Center
One of NetSpeed’s customers is a Tier-1 semiconductor company that develops some of the industry’s best performing and most complex system on chips (SoC) for the data center and cloud computing markets. To keep its leadership in the data center market, the company needs to produce best-in-class SoC solutions year after year. … Read More
Interface IP year 2015: Winners and Losers
The global Interface IP market is still growing in 2015, no doubt about it. It’s interesting to zoom in the various protocols to check their respective behavior. Which protocol generates an IP business growing more than the average market? Which protocol generates a disappointing IP business? In other words, which are the winners… Read More
Why Connect to the Cloud with Atmel SMART SAM W25?
Atmel SMART SAM W25 is in fact a module, Atmel names it “SmartConnect Module”. As far as I am concerned I like SmartConnect designation and I think it could be used to describe any IoT edge device. The device is “smart” as it includes a processing unit, in this case ARM Cortex M0 based SAMD21G, and “connect” remind the Internet part of… Read More