At the Jasper Users’ Group, Alex Netterville of ARM presented about how ARM are using formal on an unannounced processor code-named Pelican. Don’t read the presentation trying to find out information about Pelican itself, there isn’t any. That wasn’t the topic. Alex has been using formal approaches… Read More
Milandr is a company based in Moscow that makes high reliability semiconductor components for the aerospace, automotive and consumer markets, primarily in Russia. They work with multiple foundries, including X-FAB and TSMC in technologies from 1um down to 65nm. Corporate headquarter and main IC design house is located in Russian… Read More
Dassault have recently been granted a patent on their approach to managing design hierarchy. I asked them how long it took from filing the patent until it was granted and they said the whole process had taken 8 years. It is a bit of an indictment of the patent system when it takes 8 years, also known as 4 or 5 process nodes, for a patent to… Read More
I was the VP marketing at VaST Systems Technology and then at Virtutech. Both companies sold virtual platform technology which consisted of two parts:
Major power reductions are possible by reducing power at the RTL and system levels, and not just at the gate and physical level. In fact, as is so often the case in design, changes can have much more impact when done at the higher level, even given that at that point in the design there is less accurate feedback about changes. Later the… Read More
I am at ARM TechCon today. One interesting presentation was made jointly between Samsung, Cadence and ARM themselves about developing physical libraries (ARM), a tool flow (Cadence) and test chips (Samsung). It was titled Samsung ARM and Cadence collaborate on the silicon-proven world first 14-nm FinFET Cortex-A7 ARM CPU and… Read More
As semiconductors become more integrated into our lives reliability is becoming a critical issue. As IP consumes more of our die, IP reliability is becoming a critical issue. As we pack more transistors into a chip, reliability is becoming a critical issue. As we move from 28nm to 20nm to 16nm, reliability is becoming a critical … Read More
What an amazing night! I celebrated the 50[SUP]th[/SUP] anniversary of the industry I grew up in! With my beautiful wife at my side and a table full of friends we all went down memory lane, ate, drank, and then enjoyed the auction.
The tour of the new computer museum was amazing. I was learning so much up until the 1970’s, then … Read More
In case you haven’t noticed, Synopsys has been in the press lately talking about their relationship with TSMC. Since I’m an internationally recognized industry expert they gave me a call for a briefing and I was happy to do it. Staying connected with the #1 EDA company is important and fun since I get to ask questions that most people… Read More
For the tenth year, the big 3DIC conference takes place in the Hyatt Regency at Burlingame (just south of San Francisco Airport). Officially it is 3D Architectures for Semiconductor Integration and Packaging or ASIP. This year there have already been some significant 3D announcements: TSMC’s 3D program, and Micron’s… Read More
