Ann Wu is Co-founder & CEO of Silimate. Before Silimate, Ann designed several generations of custom silicon at Apple, helped manage inference ASIC programs at Meta, and led product strategy and execution at Celestial AI. Ann has a M.S. in Electrical Engineering from Stanford University and a B.S. in Electrical Engineering… Read More
The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.
The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More
Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More
Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More
Daniel is joined by Dr. Wally Rhines, CEO of Silvaco, to discuss the Electronic Design Market Data report that was just released. Wally is the industry coordinator for the EDA data collection program called EDMD. SEMI and the Electronic System Design Alliance collect data from almost all electronic design automation companies… Read More
The designation of Silicon Catalyst as the exclusive strategic partner for Microelectronics US 2026 represents a significant alignment between a leading semiconductor startup ecosystem and a rapidly growing U.S. microelectronics industry event. This partnership reflects broader trends in semiconductor innovation, … Read More
Today, Perforce IPLM stands at the intersection of data management, automation, and collaboration, shaping the way companies design the next generation of chips and systems. Looking ahead, its evolution will reflect the growing convergence of hardware, software, and AI-driven engineering.
On July 9, 2025, Michael Munsey, VP of Semiconductor Industry at Siemens, and Vishal Moondhra, VP of Solutions at Perforce, presented a DACtv session announcing their strategic partnership, as seen in the YouTube video. This collaboration integrates Siemens’ digital twin and digital thread technologies with Perforce’s version… Read More
On July 18, 2025, Jeff Wittich, Chief Product Officer at Ampure Computing, delivered a compelling DACtv presentation, as seen in the YouTube video, likening the current AI boom to the 1848 California Gold Rush. Speaking in San Francisco, just 100 miles from Sutter’s Mill, Wittich drew parallels between the historical rush that… Read More
On July 18, 2025, a DACtv session titled “From Atoms to Tokens” explored the semiconductor supply chain’s transformation, as presented in the YouTube video. The speaker tackled the challenges and innovations from the atomic level of chip fabrication to the tokenized ecosystems of AI-driven data centers, emphasizing the critical… Read More
