In the relentless pursuit of ever-increasing data speeds, the 1.6 Terabits per second (Tbps) era looms on the horizon, promising unprecedented levels of connectivity and bandwidth within data centers. As data-intensive applications proliferate and the demand for real-time processing escalates, the need for robust and efficient… Read More
Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die.
12:00 Welcome and Introduction – Mike Bartley, Tessolve
12:00 Nick Heaton, Cadence Design Systems – SoC Verification in a Multi-chip,… Read More
Before the advent of the digitized society and computer chips, things that needed protection were mostly hard assets such as jewelry, coins, real estate, etc. Administering security was simple and depended on strong guards who provided security through physical means. Then came the safety box services offered by financial … Read More
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More
Synopsys has released a Technical Bulletin entitled “Parallel-Based PHY IP for Die-to-Die Connectivity”. The piece is authored by Manuel Mota, senior product marketing manager, staff at Synopsys. Manuel has worked at Synopsys for 11 years in the IP area. Prior to that, he worked at MIPS Technologies, Chipidea (acquired… Read More
This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. This presentation is from Alchip, presented by James Huang,… Read More
This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More
