The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides… Read More
ESSDERC and ESSCIRCby Admin on 08-07-2023 at 4:56 pm
The aim of ESSCIRC and ESSDERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever… Read More
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers… Read More
Tuesday, September 27 | 10 am EDT (New York) | 9 am CDT (Chicago) | 7 am PDT (San Francisco) | 4 pm CET (Central Europe)
In this webinar, Bill Calver, Director of AcuSolve Program Management, will discuss CFD Transient simulation on Autoclave designs to replicate FDA & ISO procedures for condensation/evaporation for sterilization
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In this webinar we will examine some of the key features and advantages of Utmost IV for device modeling and characterization, and the major design flows where Utmost IV is a key component. We will also present the latest product enhancements and introduce the new Utmost IV Corner and Retargeting Module. To conclude, we will provide… Read More
Unique device identities are at the core of all computer security systems. Just as important is that each unique identity cannot be copied, because once copied they can be used illegitimately. Unique device IDs are used to ensure that communications are directed to the correct device. And they also provide the ability to encrypt… Read More
Power device designers know that when they see a deceptively simple pair of PowerMOS device symbols in the output stage of a power converter circuit schematic, they are actually looking at a massively complex network of silicon and metal interconnect. The corresponding physical devices can have a total device W on the order of … Read More
With growing size and complexity of SoC, the semiconductor community is realizing the growing pain of verification. The cost of SoC verification grows exponentially with design size. Moreover, there is no single methodology for verifying a SoC; multiple engines are used in different contexts through different verification… Read More
