Today Alchip Technologies, a Taipei-based leader in high-performance and AI computing ASICs, announced a significant milestone with the successful tape-out of its 3D IC test chip. This achievement not only validates Alchip’s advanced 3D IC ecosystem but also positions the company as a frontrunner in the rapidly evolving field… Read More
Tag: cowos
CoPoS is a Bigger Canvas for Chiplets and HBM
Alchip’s Technology and Global Talent Strategy Deliver Record Growth
Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More
IEDM Opens with a Big Picture Keynote from TSMC’s Yuh-Jier Mii
The main program for the 70th IEDM opened on Monday morning in San Francisco with an excellent keynote from Dr. Yuh-Jier Mii, Executive Vice President and Co-Chief Operating Officer at TSMC. Dr. Mii joined TSMC in 1994. Since then, he has contributed to the development and manufacturing of advanced CMOS technologies in both fab
Alchip is Paving the Way to Future 3D Design Innovation
At the recent TSMC OIP Ecosystem Forum in Santa Clara, there was an important presentation that laid the groundwork for a great deal of future innovation. Alchip and its IP and EDA partner Synopsys presented Efficient 3D Chiplet Stacking Using TSMC SoIC. The concept of 3D, chiplet-based design certainly isn’t new. SemiWiki maintains… Read More
Alchip Technologies Sets Another Record
The ASIC business has always been a key enabler of the semiconductor industry but it is a difficult business. In my 40 years I have seen many ASIC companies come and go but I have never seen one like Alchip.
Alchip Technologies Ltd. was founded more than 20 years ago, about half way through my career. I know one of the founders, a fiercely… Read More
Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Elevating AI with Cutting-Edge HBM4 Technology
Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
TSMC’s Business Update and Launch of a New Strategy
What looks like a modest market expansion strategy is all but modest.
Insights into the Semiconductor Industry and the Semiconductor Supply Chain.
As usual, when TSMC reports, the Semiconductor industry gets a spray of insights that help understand what goes on in other areas of the industry. This time, TSMC gave more insight … Read More
TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More