Synopsys Webinar | Wednesday, April 26, 2023 | 10:00 -11:00 a.m. PDT
This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed for complex multi-die
All the hubbub about FPGA-accelerated servers prompts a big question about cache coherency. Performance gains from external acceleration hardware can be wiped out if the system CPU cluster is frequently taking hits from cache misses after data is worked on by an accelerator.
ARM’s latest third-generation CoreLink CMN-600 … Read More
A mobile GPU is an expensive piece of SoC real estate in terms of footprint and power consumption, but critical to meeting user experience demands. GPU IP tuned for OpenGL ES is now a staple in high performance mobile devices, rendering polygons with shading and texture compression at impressive speeds.
Creative minds in the desktop… Read More
In the first part of this article I wrote about four types of costs which must be considered when an IP goes through design differentiation, customization, characterization, and selection and evaluation for acquisition. In this part of the article, I will discuss about the other five types of costs which must be considered to enhance… Read More
There was a time when design goals were decided in the beginning, targeted on a particular technology node, design planning done for the same, and implementation done through point tools connected indesign flows customized according to the design. It’s no longer the case for modern SoC designs; there are multiple technology … Read More
Today, an SoC is seen in the context of an optimized assembly of IPs; it’s no more a single monolithic chip design. It’s very common to see an ARM processor IP along with an interconnect IP, a memory IP, and couple of buses and interfaces IP in an SoC. Although the SoC seems to be an integrated collection of IPs, it can be very complex and… Read More
It gives me a very nice, somewhat nostalgic, feeling after attending the 52[SUP]nd[/SUP] DAC. There was a period during my final academic year in 1990 and my first job when I used to search through good technical papers in DAC proceedings and try implementing those concepts in my project work. In general, representation from ‘R&D… Read More
ARM had a big press/analyst show at the Epic Roasthouse here in San Francisco this morning. They announced a new portfolio of IP targeted at the next generation mobile experience. There were 4 components to the announcement:
Earlier this year, when I was looking at Carbon’spast year performance which provided record breaking revenue with whopping jump in bookings, one thing was certain that Carbon Performance Analysis Kits (CPAKs) would drive major growth in future, not only for Carbon, but also for the semiconductor industry. It will initiate … Read More
As the SoC design size, complexity and functionality keeps on increasing with multiple IPs packed together and design time and time-to-market keeps on decreasing amid critical constraints on PPA, there is no other alternative than to do the design first-time-right not to miss the window of opportunity. And that could be possible… Read More
