Arm announced their Neoverse plans not long ago at TechCon 2018. Neoverse is a brand, launched by Arm, to provide the foundations for cloud to edge infrastructure in support of their vision of a trillion edge devices. To a cynic this might sound like marketing hype. Sure, they’re widely used in communications infrastructure and… Read More
Device Packaging Conference 2027
ADVANCED PACKAGING FOR SCALABLE AI: CONNECTING COMPUTE, MEMORY, POWER AND PHOTONICS
Sheraton Grand at Wild Horse Pass
Phoenix, Arizona
March 1-4, 2027
The 23rd Annual IMAPS Device Packaging Conference (DPC 2027) will be held in Phoenix, Arizona, on March 1-4, 2027. It is an international event organized by the International… Read More
