Chiplet Modeling and Workflow Standardization Through CDX

Chiplet Modeling and Workflow Standardization Through CDX
by Kalar Rajendiran on 05-15-2023 at 6:00 am

Chiplet Integration Workflow

Chiplet is a hot topic in the semiconductor world these days. So much so that if one hasn’t heard that term, the person must be living on a very isolated islet. Humor aside, products built using chiplets-based methodology have been in existence for at least some years now. Companies such as Intel, AMD, Apple and others have integrated… Read More


Chip War without Soldiers

Chip War without Soldiers
by Sivakumar PR on 05-12-2023 at 6:00 am

Semiwiki Creative Final

Every country realizes the importance of producing skilled chip designers who could decide their success as soldiers by creating advanced AI chips for winning the Chip War. Also, every country is now gearing up to build a good semiconductor manufacturing ecosystem to balance the global semiconductor supply chain that could … Read More


Chiplet Q&A with Henry Sheng of Synopsys

Chiplet Q&A with Henry Sheng of Synopsys
by Daniel Nenni on 05-05-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.

Are we
Read More

Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the prefaceRead More


Multiphysics Analysis from Chip to System

Multiphysics Analysis from Chip to System
by akanksha soni on 04-10-2023 at 10:00 am

Image 1 2

Multiphysics simulation is the process of computational methods to model and analyze a system to understand its response to different physical interactions like heat transfer, electromagnetic fields, and mechanical structures. Using this technique, designers can generate physics-based models and analyze the behavior… Read More


Chiplets, is now their time?

Chiplets, is now their time?
by Daniel Nenni on 03-31-2023 at 6:00 am

P3221015 cropped

Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon CatalystRead More


Podcast EP148: The Synopsys View of High-Performance Communication and the Role of Chiplets

Podcast EP148: The Synopsys View of High-Performance Communication and the Role of Chiplets
by Daniel Nenni on 03-17-2023 at 10:00 am

Dan is joined by John Swanson, who is the HPC Controller & Datapath Product Line Manager in the Synopsys Solutions Group. John has worked in the development and deployment of verification, integration, and implementation tools, IP, standards, and methodologies used in IP-based design for over 25 years at Synopsys.

Dan explores… Read More


Who will Win in the Chiplet War?

Who will Win in the Chiplet War?
by Daniel Nenni on 01-16-2023 at 6:00 am

Chiplet APEC

The first Chiplet specific conference is coming up which is a milestone in itself. As we know the only thing new about chiplets is the name but when there is a dedicated conference to such a specific thing you know it has officially “arrived”. There is even a cool new tagline: Chiplets make huge chips happen!

“The First Annual Chiplet… Read More


The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
by Kalar Rajendiran on 12-27-2022 at 6:00 am

High End Performance Packaging Spectrum

From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More


Chiplets UCIe Require Verification

Chiplets UCIe Require Verification
by Daniel Nenni on 12-20-2022 at 6:00 am

UCIe VIP Truechip

Chiplets have been trending on SemiWiki for the past two years and I think that will continue into the distant future. As a potential way to unclog Moore’s Law, you can bet the semiconductor ecosystem will prove once again to be a chiplet force of nature driving semiconductor company roadmaps to smaller and better things.

To be clear,… Read More