GenAI, the most talked-about manifestation of AI these days, imposes two tough constraints on a hardware platform. First, it demands massive memory to serve large language model with billions of parameters. Feasible in principle for a processor plus big DRAM off-chip and perhaps for some inference applications but too slow … Read More
2024 DVCon was very busy this year. Bernard Murphy and I were in attendance for SemiWiki, he has already written about it. Multi die and chiplets was again a popular topic. Lauro Rizzatti, a consultant specializing in hardware-assisted verification, moderated an engaging panel, sponsored by Synopsys, focusing on the intricacies… Read More
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
Security threats are a hot topic of discussion today as they can have a profound impact on the electronic infrastructure and devices that are the backbone of our global economies. It is also clear that these threats can be introduced during the design of the very devices that we rely on in our daily lives.
Chiplet-based design is … Read More
Dan is joined by Nick Ilyadis, vice president of product planning at Achronix. Prior to Achronix, Nick was vice president of portfolio and technology strategy at Marvell Semiconductor and vice president and group CTO at Broadcom. Nick has also held many engineering roles during his career, starting as a chip designer and moving… Read More
Quite a few of the articles I now see about the semiconductor industry use AI. It is not hard to tell, especially for someone like myself, a 40 year experienced semiconductor professional who also writes. In the last 13 years (yes SemiWiki is now a teenager) we have published 9,058 blogs. SemiWiki was the first of now many semiconductor… Read More
Dan is joined by Tony Chan Carusone, Chief Technology Officer of Alphawave Semi. Tony has been a professor of Electrical and Computer Engineering at the University of Toronto since 2001 and has served as a Distinguished Lecturer for the IEEE Solid-State Circuits Society and on the Technical Program Committees of the world’s leading… Read More
Chiplets have simplified one area of design but opened pandora’s box on another front. The simulation complexity of each chiplet is lower but now the chiplet-to-chiplet interconnect has become complex. Folks are experimenting with different interconnect protocols, variations of UCIe, modifying UCIe settings, interface… Read More
The second annual Chiplet Summit is coming up and if it is anything like the first one it will not disappoint. Chiplets are a disruptive semiconductor technology that are already being used by the top semiconductor companies like Intel, Nvidia, AMD and others. These companies design their own chiplets so they are blazing the trail… Read More
Matt develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. It has been an honor working with Matt and his team for the last 3 years and I value… Read More
