CFD in Microfluidics and Biomedical Devices

CFD in Microfluidics and Biomedical Devices
by Admin on 06-19-2020 at 10:30 am

June 19, 2020

10:30 AM IST

Venue:
Online

Providing healthcare access to people living in poverty across the world could dramatically improve global well-being, especially during the ongoing COVID-19 pandemic. However, many diagnostic devices are cost-prohibitive and difficult to deploy in the field under extremely challenging

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Geometry Preparation for CFD using Ansys SpaceClaim Direct Modeler

Geometry Preparation for CFD using Ansys SpaceClaim Direct Modeler
by Admin on 05-26-2020 at 10:00 am

May 26th at 10:00 AM PST

 

In this session, we will be going over basic geometry preparation for CFD analyses using ANSYS SpaceClaim Direct Modeler. We will be demonstrating the functionalities of main tools in SpaceClaim for CFD geometry pre-processing. Some of the important steps that we will cover include:

  • Repairing
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18th INTERNATIONAL ICING COURSE

18th INTERNATIONAL ICING COURSE
by Admin on 05-26-2020 at 12:00 am

18th INTERNATIONAL ICING COURSE

Simulation Methods (CbA) for the In-flight Icing
Certification of Aircraft, Rotorcraft and Jet Engines

Montreal, Canada
Tuesday May 26 to Friday May 29, 2020

Come and See Icing Certification-by-Analysis Tools in Practice

For an aircraft, rotorcraft or jet engine to obtain a type design certification,… Read More


7 Tips in 17 Minutes | Leveraging CFD for Electronics

7 Tips in 17 Minutes | Leveraging CFD for Electronics
by Admin on 04-21-2020 at 11:00 am

April 21, 2020

11:00 AM (EDT)

Venue:
Online

We’re back at it again in our new Ansys Discovery Webinar Series, now sharing CFD knowledge in under 17 minutes!

KEY TAKEAWAYS:

  • Understanding design trade-offs through CFD Analysis
  • Seven (7) productive tips you can leverage immediately in a CFDr Workflow
  • Learn how you can perform
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Pathfinding to an Optimal Chip/Package/Board Implementation

Pathfinding to an Optimal Chip/Package/Board Implementation
by Tom Dillinger on 02-04-2016 at 4:00 pm

A new term has entered the vernacular of electronic design engineering — pathfinding. The complexity of the functionality to be integrated and the myriad of chip, package, and board technologies available make the implementation decision a daunting task. Pathfinding refers to the method by which the design space of technology… Read More


The Fine Art of Engineering

The Fine Art of Engineering
by Nazita Saye on 01-28-2016 at 12:00 pm

There’s a small art gallery near the office. It features a new set of paintings by a local artist every two weeks. As I walk by I tend to check out what’s hanging in there. Sometimes I turn up my nose at what I see – a bit too wacky, a bit too abstract, a bit too paint by numbers. Sometimes I walk in to take a closer look but leave the shop empty-handed… Read More


A Complete Simulation Platform for Mobile Systems

A Complete Simulation Platform for Mobile Systems
by Pawan Fangaria on 08-23-2015 at 7:00 am

If we take an insight into the semiconductor industry, we can easily find that mobile systems are the main drivers of this industry. The Smartphone business has remained at the top since a good number of years. Although the Smartphone sales growth has started showing a sign of stagnation, it is still a main contributor with a solid… Read More


Electronic Thermal Management through Icepak

Electronic Thermal Management through Icepak
by Pawan Fangaria on 08-03-2014 at 8:30 pm

Last week my daughter was playing some games on my Google Nexus smartphone for a while when one of my friends called. When I picked up the phone, I couldn’t imagine it was so hot. There is no doubt; every electronic device today emits an order of magnitude higher heat than what it used to at most a decade ago. There is so much emphasis on … Read More


Temperature – The Fourth Aspect to Look at in SoC Design

Temperature – The Fourth Aspect to Look at in SoC Design
by Pawan Fangaria on 07-25-2014 at 2:00 pm

In my career in semiconductor industry, I can recall, in the beginning there was emphasis on design completion with automation as fast as possible. The primary considerations were area and speed of completion of a semiconductor design. Today, with unprecedented increase in multiple functions on the same chip and density of the… Read More


Managing Heat for System Reliability

Managing Heat for System Reliability
by Pawan Fangaria on 01-17-2014 at 8:30 am

In most of the electronic equipments, semiconductor chips are a major source of heat generation. And in semiconductor designs several hardware and software techniques are being used to contain power dissipation; a major cause for heat. However due to multiple functionality being squeezed into small form factors, we continue… Read More