Being new in Ottawa and trying to get some momentum towards automation in full custom layout I was telling industry people that I am interested to work with everybody to move this agenda forward. My Director of Engineering at that time, Peter Gillingham, took me to visit Carleton University in Ottawa. One of his professor friends,… Read More
One might be tempted to think that technology driven gains in computer performance might be enough to keep up with the needs of design and verification tools. We know that design complexity is increasing at a rate predicted by Moore’s Law. We also know that the performance of the computers used during IC development benefit from … Read More
Back in the early 1980’s during the nascent years of electronic design automation (EDA), I worked at Texas Instruments supporting what would become their merchant ASIC business. Back then, life was a bit different. The challenge we faced was to make our ASIC library available on as many EDA flows as we could to give as many users as… Read More
Just prior to the opening of the 54[SUP]th[/SUP] Design Automation Conference, Mentor, a Siemens company, and PhoeniX Software issued a press release announcing a new integration between their tools to help designers of photonic ICs (PICs) to close the loop for manufacturing sign-off verification. This is a significant piece… Read More
After reading the Cadence blog post –“Dracula, Vampire, Assura, PVS: A Brief History” – Dr. Andrew Moore has written the below article where he helps readers get a sense as to what “the year of hell” was like, from one of the key individuals who lived it. Andrew also addresses and corrects some of the “urban legends”… Read More
It seems like I have written a lot about SRAM lately. Let’s face it SRAM is important – it often represents large percentages of the area on SOC’s. As such, SRAM yield plays a major role in determining overall chip yields. SRAM is vulnerable to defect related failures, which unlike variation effects are not Gaussian in nature. Fabrication… Read More
I caught up with John Ferguson of Mentor Graphics this week to learn more about a recent announcement that TSMC has extended its collaboration with Mentor in the area of Fan-Out Wafer Level Processing (FOWLP).
In March of last year Mentor and TSMC announced that they were collaborating on a design and verification flow for TSMC’s… Read More
A few weeks back I wrote an article mentioning that Mentor Graphics has been quietly working on solutions for photonic integrated circuits (PICs) for some time now, while one of their competitors has recently established a photonics beachhead. One of the most common challenges for PIC designs is their curvilinear nature, thus… Read More
If you don’t get the tongue in cheek reference of the title, you probably don’t have children who liked to watch Disney movies. All four of my daughters loved Disney and so, I am forever shaped by the Wonderful World of Disney. In 2007 Disney adapted to the screen a novel called, ‘A Bridge to Terabithia’, in which two adolescents escape… Read More
This year is shaping up to be an inflection point, when multi-die packaging technology will experience tremendous market growth. Advanced 2.5D/3D package offerings have been available for several years, utilizing a variety of technologies to serve as the package substrate, interposer material for embedding die micro-bump… Read More
