This will be one of the more interesting Mentor User Group Meetings now that the Siemens acquisition has fully taken effect and the new management team is in place. The Mentor User Conference is at the Santa Clara Marriott, Santa Clara, California on May 2, 2019 from 9:00 am to 6:00pm.
Remember, in 2017 Siemens acquired Mentor Graphics… Read More
Last week TSMC announced the availability of its complete 5nm design infrastructure that enables SoC designers to implement advanced mobile and high-performance computing applications for the emerging 5G and AI driven markets. This fifth generation 3D FinFET design infrastructure includes technology files, PDKs (Process… Read More
When floor planning (FP) and place & route (P&R) tools took over from custom layout tools for standard cell based designs, life became a lot better for designers of large digital chips. The beauty of the new flows was that all the internals of the standard cells and many IP blocks were hidden from view, lightening the load … Read More
CMP (Chemical Mechanical Planarization or also known as Chemical Mechanical Polishing) is a wafer fabrication step applied generally after a chemical deposition –intended to smoothen and to flatten (planarize) wafer surfaces with the combination of chemical and mechanical forces. Developed at IBM and since its introduction… Read More
Gerry Hsu’s departure from Cadence to form Avanti (originally named ArcSys) is chronicled in legal testimony as accusations of theft of software were followed by legal battles, financial awards and even prison terms. Mentor and Synopsys were… Read More
Light is a form of energy. It reveals an object’s color and shape through the refraction (passing through light) or the reflection (bouncing back light) of its beam. While photon is the smallest measure of light, the term photonicscan be defined as the science and technology of generating, controlling, and detecting photons. … Read More
I joined Mentor Graphics (now Mentor, A Siemens Business), in late 1993. Tom Engibous, one of my direct reporting people at TI, was promoted to replace me as head of the Semiconductor business of TI and I moved on to what I knew would be a real challenge,… Read More
During the design cycle as tape out approaches, time pressure usually goes up dramatically. To make matters worse the design itself is much larger, because all the block level work is done and there is a requirement to work with the entire database. It feels like it’s time to put aside the garden trowel and start using a steam shovel.… Read More
Advanced process technology offers both device and interconnect scaling for increased design density and higher performance while invoking also significant implementation complexities. Aside from the performance, power and area (PPA) aspects, designer is getting entrenched with the need of tackling more reliability … Read More
Design process retargeting is acommon recurrence based on scaling orBOM(Bill-Of-Material) cost improvement needs. This occursnot only with the availability of foundry process refresh to a more advanced node,but also to any new derivative process node tailored towards matching design complexity, power profile or reliability… Read More
