Goldilocks Solution for SOC Processors

Goldilocks Solution for SOC Processors
by Tom Simon on 02-15-2019 at 7:00 am

SOC designers face choices when it comes to choosing how to implement algorithms in their designs. Moving them to hardware usually offers advantages of smaller area, less power and faster processing. Witness the migration of block chain hashing from CPUs to ASICs. However, these advantages can come with trade-offs. For one, … Read More


Upcoming ARM & Open-Silicon Webinar on Custom SOC’s for IoT

Upcoming ARM & Open-Silicon Webinar on Custom SOC’s for IoT
by Tom Simon on 03-08-2016 at 12:00 pm

IoT products call for a higher level of system integration than ever before. Companies seeking to go to market now have a much higher bar in terms of size, power, reliability and manufacturability. The first IoT devices evolved from embedded development boards, like the groundbreaking Arduino. These were fine for prototypes … Read More


Facts Support New Emergence in Semiconductor Landscape

Facts Support New Emergence in Semiconductor Landscape
by Pawan Fangaria on 01-03-2015 at 9:00 am

As we left an exciting year 2014 which is poised to record 7+ % increase in semiconductor revenue (~ $338 B) compared to 2013 (~ $315 B) and entered into another promising year 2015 for semiconductors, I looked back over the year bygone and collected inferences from some of the major important events which clearly convey how 2015 can… Read More


3D, The State of the State

3D, The State of the State
by Paul McLellan on 12-11-2014 at 8:00 am

I have been at the 3D ASIP conference that is held every year in Burlingame. It is far and away the best place to get a snapshot on what is going on in 3D (and 2.5D) IC design each year. One of the presentations was by the guys from Yole on where the industry is right now. Other presentations were on pathfinding, power reduction (did you know… Read More


3DIC in Burlingame

3DIC in Burlingame
by Paul McLellan on 12-01-2014 at 7:00 am

Every year in December is what I think of as the main 3D IC conference where you can get up to speed on all the latest. Officially it is called 3D Architectures for Semiconductor and Packaging or 3D ASIP. It is held in the Hyatt Regency in Burlingame (the one right by 101 near the airport). This year it is from December 10-12th.

The first… Read More


Codasip and Coby and Czech

Codasip and Coby and Czech
by Paul McLellan on 11-24-2014 at 12:00 am

At ARM TechCon I ran into Coby Hanoch who has just been appointed VP worldwide sales of a comany that I’d not previously heard of called Codasip. As the name implies they supply code, and ASIPs. Well, actually IP source code and ASIP tools. The company is based in Brno (pronounced pretty much like Bruno) in the Czech republic … Read More


How to Design an LTE Modem

How to Design an LTE Modem
by Paul McLellan on 09-16-2013 at 4:24 pm

Designing an LTE modem is an interesting case study in architectural and system level design because it is pretty much on the limit of what is possible in a current process node such as 28nm. I talked to Johannes Stahl of Synopsys about how you would accomplish this with the Synopsys suite of system level tools. He is the first to admit… Read More


Custom Processors: Webinar

Custom Processors: Webinar
by Paul McLellan on 02-21-2012 at 5:24 pm

What is a custom processor? Or Application Specific Instruction-set Processor (ASIP) which is the buzzword which may or may not catch on.

Most programming is done on a processor with a fixed instruction set: think Intel x86 or ARM. Intel or ARM decided on what instructions to include, based on a lot of benchmarking across a wide range… Read More