Extending RISC Processors into Flexible Accelerators using ASIP Designer
Wednesday, May 24, 2023
5:00 – 7:00 p.m. CEST | 8:00 – 10:00 a.m. PT
Case Studies in Low-Power Smart Vision and Post-Quantum Cryptography Applications
The slow-down of Moore’s law and Dennard scaling triggered an increased awareness for … Read More
Extending Processors into Flexible Accelerators for 5G using ASIP Designer
Join us for the ASIP Wireless Seminar 2022, to learn why domain-specific processors (also referred to as application-specific processors, or ASIPs, for short) gain a lot of attention these days, and why Synopsys’ ASIP Designer™ is the industry’s leading… Read More
SOC designers face choices when it comes to choosing how to implement algorithms in their designs. Moving them to hardware usually offers advantages of smaller area, less power and faster processing. Witness the migration of block chain hashing from CPUs to ASICs. However, these advantages can come with trade-offs. For one, … Read More
IoT products call for a higher level of system integration than ever before. Companies seeking to go to market now have a much higher bar in terms of size, power, reliability and manufacturability. The first IoT devices evolved from embedded development boards, like the groundbreaking Arduino. These were fine for prototypes … Read More
As we left an exciting year 2014 which is poised to record 7+ % increase in semiconductor revenue (~ $338 B) compared to 2013 (~ $315 B) and entered into another promising year 2015 for semiconductors, I looked back over the year bygone and collected inferences from some of the major important events which clearly convey how 2015 can… Read More
I have been at the 3D ASIP conference that is held every year in Burlingame. It is far and away the best place to get a snapshot on what is going on in 3D (and 2.5D) IC design each year. One of the presentations was by the guys from Yole on where the industry is right now. Other presentations were on pathfinding, power reduction (did you know… Read More
3DIC in Burlingameby Paul McLellan on 12-01-2014 at 7:00 amCategories: Events
Every year in December is what I think of as the main 3D IC conference where you can get up to speed on all the latest. Officially it is called 3D Architectures for Semiconductor and Packaging or 3D ASIP. It is held in the Hyatt Regency in Burlingame (the one right by 101 near the airport). This year it is from December 10-12th.
The first… Read More
At ARM TechCon I ran into Coby Hanoch who has just been appointed VP worldwide sales of a comany that I’d not previously heard of called Codasip. As the name implies they supply code, and ASIPs. Well, actually IP source code and ASIP tools. The company is based in Brno (pronounced pretty much like Bruno) in the Czech republic … Read More
