Arteris finally announced this morning, as rumored, that Qualcomm is acquiring “certain technology assets” and hired personnel formerly employed by Arteris. The financial terms were not disclosed.
I talked to Charlie Janac, the CEO, today. The first thing I asked him is why such a convoluted deal, I’ve never… Read More
Is it really a surprise if Qualcomm, the undisputed leader of Application Processor (AP) and BaseBand (BB) IC for wireless mobile, already one of the Arteris investors (with ARM, Synopsys, Docomo Capital and a bunch of VC), eventually acquires the best NoC IP technology (the technology, the engineering team and the rights, but… Read More
We still don’t know the precise status about a potential acquisition of Arteris by Qualcomm, and I prefer not to comment a rumor and wait for the official announcement, if any. But I would like to comment … a comment about this rumor, recently made by Sonics. This comment has taken the form of an Open Letter, from “Grant Pierce, CEO of… Read More
I don’t remember seeing an open letter from one EDA or IP company to another until today. Sonics have published an open letter to Charlie Janac, the CEO of Arteris. What seems to have happened is that Arteris have sold their assets to Qualcomm and the development team (which is based in France) and several AEs are already Qualcomm… Read More
In recent times semiconductor companies have revealed their intentions to license their in-house processor architectures for the first time – IBM want to license their Power CPU architecture, nVidia to license their GPU architecture. Most recently, a rumor has surfed: Qualcomm will license their DSP architecture. We should… Read More
I just read this very interesting article posted by Kurt Shuler from Arteris, describing the “History of SoC Interconnect Fabric” and explaining why the SC industry needs an advanced approach, named the “fourth phase of the Interconnect Fabric history” in the article. Kurt’s point of view is that in the past the SoC interconnect… Read More
Application Processor SoC integrates more and more functions, generation after generation, challenging performance, cost, power efficiency, reliability, and time-to-market. But the maximum die size can’t increase, at least because of the constraints linked with wafer production, manufacturability, yield and finally… Read More
Interface IP typically consists of multiple layers, most importantly a PHY (level 1) analog (or mixed signal) block that handles the interface to the outside world and a number of levels of digital controllers. The interfaces between all these levels, especially between the PHY and the controller, is often defined by the interface… Read More
Virtual platforms enable software development to take place on a model of an electronic system. What everyone would like is models that are fast and accurate but that is simply not possible. Fast models are fast because they don’t model everything at the signal level. And accurate models get to be accurate by handling a lot of detail… Read More
I have mentioned NoC adoption explosion during the last two years, illustrated by the huge revenue growth of Arteris. This trend is now confirmed in the fastest moving segments, the Application Processors (AP) and LTE Modem for mobile applications. In fact, Arteris FlexNoC has been integrated in the majority of AP and LTE Modem… Read More
