Before chiplets arrived, it seemed like designing an electronic system was a bit simpler, as a system on chip (SoC) methodology was well understood, and each SoC was mounted inside a package, then the packages for each component were interconnected on a printed circuit board (PCB). The emerging trend to design a 3D IC using chiplets… Read More
Webinar: What it really takes to build a future-proof AI architecture?
Abstract
As AI workloads increasingly dominate numerous cloud and edge applications, building a scalable, efficient, and future-ready AI chips is no longer optional—it’s essential. This webinar explores the latest AI trends, highlighting the growing demand for intelligent processing closer to the data source and