The 15th TSMC Open Innovation Platform® (OIP) was held last week. In preparation we did a podcast with one of the original members of the TSMC OIP team Dan Kochpatcharin. Dan and I talked about the early days before OIP when we did reference flows together. Around 20 years ago I did a career pivot and focused on Strategic Foundry Relationships.… Read More
Webinar: Intro to Ansys Sherlock for Electronics Reliability
Rand Simulation’s FEA (Structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via virtual testing (simulation).
During this webinar, you’ll learn about:
– The environmental challenges that printed… Read More