Background
Traditionally, the interface between chip designers and system power, packaging, reliability, and mechanical engineering teams was a relatively straightforward exchange of specifications. Chip designers developed preliminary power dissipation estimates, often based on a simplifying power/mm**2 value. … Read More
The move from single-chip design to system-in-package design has created many challenges. The rise of 2.5D and 3D technology has set the stage for this. Beyond the modeling requirements and the need for ecosystem collaboration to get those models, there is a significant challenge in understanding the data. The only way to truly… Read More
Ansys addresses complex Multiphysics simulation and analysis tasks, from device to chip to package and system. When I was at eSilicon we did a lot of work on 2.5D packaging and I can tell you tools from Ansys were a critical enabler to get the chip, package and system to all work correctly.
Ansys recently published an Application Brief… Read More
Advanced packaging technology is enabling “More Than Moore” scaling of heterogeneous technology die. At the recent EDPS Symposium in Milpitas, Craig Hillman, Director of Product Development, DfR Solutions, at ANSYS gave a compelling presentation, “Reliability Challenges in Advanced Packaging”. The key takeaway messages… Read More
The introduction of 5G communications support offers tremendous potential across a broad spectrum of applications (no pun intended). 5G is indeed quite encompassing, across a wide range of frequencies – the figure below illustrates the common terminology used, from low-band, mid-band (“sub 6G”), and high-band (“mmWave”)… Read More
