Designers require comprehensive logical, physical, and electrical models to interpret the results of full-chip power noise and electromigration analysis flows, and subsequently deduce the appropriate design updates to address any analysis issues. These models include: LEF, DEF, Liberty library models (including detailed… Read More
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Webinar: Signoff for Thermal, Reliability and More in Advanced FinFET designs
In automotive applications, advanced FinFET processes are great for high levels of integration and low power. But they also present some new challenges in reliability signoff. Ansys will be hosting a webinar to highlight the challenges faced by engineers trying to ensure thermal, electromigration (EM) and electrostatic discharge… Read More