There was a lot of discussion at IEDM about the coming shift to gate-all-around (GAA) transistor structures. This new device brings many benefits to continue device scaling, both at the monolithic device level as well as for multi-die design. The path to GAA is not simple, there are new material, process and design considerations… Read More
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
As the focal point of the TSMC OIP ecosystem, TSMC has been driving important initiatives over the last few years to bring multi-die systems to the mainstream. As the world is moving quickly toward Generative AI technology and AI-based systems, multi-die and chiplet-based implementations are becoming essential. TSMC recently… Read More
Over its 40+ year history, electronic design automation (EDA) has seen many companies rise, fall, and merge. In the beginning, in the 1980s, the industry was dominated by what came to be known as the big three — Daisy Systems, Mentor Graphics, and Valid Logic (the infamous “DMV”). The Big 3 has morphed over the years, eventually settling… Read More
TSMC recently held their annual Technology Symposium in Santa Clara, CA. The presentations provide a comprehensive overview of their technology status and upcoming roadmap, covering all facets of the process technology and advanced packaging development. This article will summarize the highlights of the advanced packaging… Read More
