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Intel Comes Clean on 14nm Yield!

Intel Comes Clean on 14nm Yield!
by Daniel Nenni on 12-04-2013 at 8:00 am

Hopefully this blog will result in a meaningful discussion on truth and transparency, and how Intel can do better in regards to both. Take a close look at the manufacturing slides presented by William Holt, Executive Vice President General Manager, Intel Technology and Manufacturing Group. You can see the slide deck HERE. Slide… Read More


Intel’s Tale of Two Cities

Intel’s Tale of Two Cities
by Ed McKernan on 11-27-2013 at 11:00 pm

It was a year ago that Paul Otellini made his surprise announcement that he was stepping down as CEO of Intel. Soon after, I wrote an article asserting that the only correct choice for his replacement was Nvidia’s CEO Jen Hsun Huang. I went beck to reread what I wroteand I can scarcely say I would change anything I put in the article assumingRead More


Intel Bay Trail Fail II

Intel Bay Trail Fail II
by Daniel Nenni on 11-27-2013 at 9:00 am

To follow up my Bay Trail Fail blog which predicted that the leading edge Intel 22nm mobile SoC offering would fail, I must admit I was wrong. I did not think Bay Trail would see any traction in the tablet market but, as it turns out, Intel will ship 40M of those parts in 2014. Did you notice I said ship and not sell? Read on……… … Read More


Intel’s Mea Culpa!

Intel’s Mea Culpa!
by Daniel Nenni on 11-24-2013 at 11:00 am

The Intel analyst meeting last week reads like an absolute train wreck with INTC stock dropping 5%+ the very next day. Since I work in the fabless semiconductor ecosystem during the day I was not able to listen to it live like the other pundits. Nor am I as easily fooled by Power Point slides. I did however review the materials and would… Read More


QCOM delivers first TSMC 20nm mobile chips!

QCOM delivers first TSMC 20nm mobile chips!
by Daniel Nenni on 11-21-2013 at 3:00 pm

QCOM is now sampling the TSMC 20nm version of its market dominating Gobi LTE modem. The announcement also included a new turbo charged version of their 28nm Snapdragon 800 SoC with a Krait 450 quad core CPU and Adrino 420 GPU. Given the comparable benchmarks between the Intel 22nm SoC and the 28nm SoCs from Apple and QCOM, the new 20nm… Read More


Revisiting Andy Grove’s "Only the Paranoid Survive"

Revisiting Andy Grove’s "Only the Paranoid Survive"
by Ed McKernan on 11-19-2013 at 10:00 pm

Over the course of the last fifty years there have been two significant books that have delivered emotional and operational clarity on the rise and fall of high tech companies and industries: The Innovator’s Dilemma and Only the Paranoid Survive. Amazingly, these two books were released within a year of each other (1996, 1997) … Read More


Is FD-SOI Really Faster, Cooler, Simpler?

Is FD-SOI Really Faster, Cooler, Simpler?
by Eric Esteve on 11-12-2013 at 5:17 am

I love the slogan associated with FD-SOI: the technology is supposed to be Faster, Cooler, Simpler. Does this slogan reflect the reality? Let’s start with Simpler. We (the semiconductor industry) have the perception that Silicon On Insulator (SOI) technology is something complex and exotic. Why? Because SOI has been used to … Read More


Xilinx Begins Shipping TSMC 20nm FPGAs!

Xilinx Begins Shipping TSMC 20nm FPGAs!
by Daniel Nenni on 11-11-2013 at 10:00 am

Xilinx just announced the shipment of the first TSMC based 20 nm FPGAs, beating Altera to the punch yet again. Xilinx was also the first to ship TSMC 28nm FPGAs and will undoubtedly beat Altera to 14nm which could be the knockout punch we have all been waiting for. The Xilinx UltraScale is a new family of FPGAs that will use 20nm and 16nm… Read More


Can Intel Catch Samsung? Can Anybody Catch Samsung?

Can Intel Catch Samsung? Can Anybody Catch Samsung?
by Daniel Nenni on 11-08-2013 at 5:00 pm

As a professional conference attendee I see a lot of keynotes, some good and some bad. I saw a great one from Kurt Shuler at the SEMICO IP Impact Conference last week. Why this conference was not standing room only I do not know. Kurt’s characterization of the semiconductor industry was well worth the price of admission. I didn’t actually… Read More


Xilinx and TSMC: Volume Production of 3D Parts

Xilinx and TSMC: Volume Production of 3D Parts
by Paul McLellan on 11-07-2013 at 1:23 pm

A couple of weeks ago, Xilinx and TSMC announced the production release of the Virtex-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS)… Read More