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WP_Term Object
(
    [term_id] => 158
    [name] => Semiconductor
    [slug] => semiconductor-manufacturers
    [term_group] => 0
    [term_taxonomy_id] => 158
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1395
    [filter] => raw
    [cat_ID] => 158
    [category_count] => 1395
    [category_description] => 
    [cat_name] => Semiconductor
    [category_nicename] => semiconductor-manufacturers
    [category_parent] => 0
    [is_post] => 
)

Intel and TSMC Take Different Paths to High-NA EUV

Intel and TSMC Take Different Paths to High-NA EUV
by Daniel Nenni on 08-07-2026 at 8:00 am

Intel TSMC HNA EUV 2026

Intel and TSMC are pursuing the same objective—manufacturing smaller, faster, and more energy-efficient semiconductors—but they have adopted different strategies for advanced lithography. Intel moved early to develop High-Numerical-Aperture Extreme Ultraviolet lithography, commonly called High-NA EUV, while TSMC… Read More


Intel Foundry and the DAC2026 Ecosystem

Intel Foundry and the DAC2026 Ecosystem
by Daniel Nenni on 08-07-2026 at 6:00 am

Intel Foundry DAC2026

The Design Automation Conference in Long Beach was a pleasant surprise. It drew strong attendance from leading companies across the semiconductor ecosystem, along with an impressive number of newcomers. AI-focused EDA companies came out in force—and delivered.

Intel Foundry also made its presence felt, reminding everyone… Read More


Executive Interview with James Huang of AlChip

Executive Interview with James Huang of AlChip
by Daniel Nenni on 08-03-2026 at 2:00 pm

James Huang

I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.

James is acknowledged as a leading light in advanced node ASICs, based… Read More


Podcast EP358: How Custom Silicon Development Allowed Cisco to Fuel New Innovation for Its Customers

Podcast EP358: How Custom Silicon Development Allowed Cisco to Fuel New Innovation for Its Customers
by Daniel Nenni on 07-31-2026 at 2:00 pm

Daniel is joined by Nick Kucharewski Senior Vice President and General Manager for Cisco’s silicon development organization. In this role he is responsible for the end-to-end strategy, cross-functional execution, organization alignment, and product roadmap for Silicon One, Cisco’s uniquely scalable and programmable … Read More


The Difference Between TSMC CoWoS-S and CoWoS-R

The Difference Between TSMC CoWoS-S and CoWoS-R
by Daniel Nenni on 07-31-2026 at 6:00 am

The Difference Between CoWoS S and CoWoS R

CoWoS-S and CoWoS-R are two versions of TSMC’s Chip-on-Wafer-on-Substrate advanced packaging platform. Both technologies are designed to combine high-performance processors, chiplets and high-bandwidth memory, or HBM, within a single package. This shortens the electrical connections between computing and memory components,… Read More


Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage

Previewing FMS 2026: The Next Frontier of Enterprise Memory, CXL, and AI-Era Storage
by Daniel Nenni on 07-29-2026 at 10:00 am

FMS 2026 Partner socials (5) (1)

For anyone tracking enterprise infrastructure, the storage landscape is moving at a breakneck pace. The explosive growth of generative AI, multi-million token context windows, and massive data-centric workloads have pushed traditional memory and storage architectures to their absolute limits.

This August, the industry… Read More


Five Myths about the Current Memory Boom

Five Myths about the Current Memory Boom
by Daniel Nenni on 07-26-2026 at 6:00 pm

Five Myths about the Current Memory Boom

The current semiconductor memory boom is mainly an AI-driven capacity-allocation problem, not simply a lack of factories.

AI accelerators require enormous quantities of high-bandwidth memory, or HBM. HBM is used alongside GPUs and custom AI chips because it can move data much faster than ordinary server memory. As companies… Read More


How Fast Can a Performance Model Actually Be Built?

How Fast Can a Performance Model Actually Be Built?
by Admin on 07-26-2026 at 4:00 pm

SimplEx MicroCircuitSutra Performance Model 2026 07 20 Fig

By Thang Tran, CEO of Simplex Micro and Umesh Sisodia, CEO of CircuitSutra

Performance models have a reputation problem. They’re often treated as a long-lead, high-effort undertaking — something a design team commits to early and then waits on for months before it’s useful. The development of SimplEx Micro’s… Read More


TSMC CoPoS Versus Intel EMIB Semiconductor Packaging

TSMC CoPoS Versus Intel EMIB Semiconductor Packaging
by Daniel Nenni on 07-24-2026 at 10:00 am

TSMC CoPos Versus Intel EMIB 2026

TSMC’s CoPoS, generally described as Chip-on-Panel-on-Substrate, and Intel’s EMIB, or Embedded Multi-die Interconnect Bridge, address the same strategic problem: integrating increasingly large, heterogeneous chiplet systems. However, they attack different physical constraints. CoPoS is an emerging panel-level … Read More


The Silicon Shield Has Never Been Stronger!

The Silicon Shield Has Never Been Stronger!
by Daniel Nenni on 07-24-2026 at 6:00 am

The Taiwan Silicon Shield

The “Silicon Shield” describes the idea that Taiwan’s central role in advanced semiconductor manufacturing raises the economic and strategic cost of military action against the island. The shield is not a literal defense system. It is a form of structural deterrence created by technological concentration: governments and… Read More