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CEO Interview with Daniel Schall of Black Semiconductor

CEO Interview with Daniel Schall of Black Semiconductor
by Daniel Nenni on 06-05-2026 at 6:00 am

Dr. Daniel Schall Ceo Interview SemiWiki

Dr. Daniel Schall is CEO and Co-Founder of Black Semiconductor. He holds a PhD in graphene optoelectronics from RWTH Aachen University. His work has shaped integrated photonics for over a decade, driving innovation in chip-to-chip communication. As co-founder of Black Semiconductor, his focus is on rethinking current solutions… Read More


Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools
by Daniel Nenni on 06-04-2026 at 6:00 am

synopsys intel linkedin update 1200x1200 v3

As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More


TSMC Expands Use of NVIDIA AI Technologies Across Chip Production Operations

TSMC Expands Use of NVIDIA AI Technologies Across Chip Production Operations
by Daniel Nenni on 06-03-2026 at 10:00 am

TSMC Expands Use of NVIDIA AI Technologies Across Chip Production Operations

TSMC, the world’s largest contract semiconductor manufacturer, is significantly expanding its deployment of NVIDIA artificial intelligence and accelerated computing technologies throughout its chip design and manufacturing operations. The initiative represents one of the most comprehensive applications of AI within… Read More


TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation

TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation
by Daniel Nenni on 06-02-2026 at 6:00 am

TSMC Pioneers a New Era in AI Powered Trade Secret Management

As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More


Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2P

Breaking the Clock Lane Barrier: MIPI C-PHY/D-PHY Combo IP on TSMC N2P
by Daniel Nenni on 06-01-2026 at 6:00 am

Mixel MIPI 2026

The transition to advanced process nodes is reshaping high-speed interface IP requirements for mobile, automotive, AR/VR, and AI edge devices. As SoC designers migrate to cutting-edge foundry technologies, the demand for highly optimized MIPI PHY solutions continues to grow. A key development in this space is the availability… Read More


Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan

Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan
by Daniel Nenni on 05-29-2026 at 6:00 am

Re Spins Get You Fired, Says Intel CEO Lip Bu Tan

Intel CEO Lip-Bu Tan’s statement that “re-spins get you fired” reflects the enormous pressure facing semiconductor companies as chip complexity, manufacturing costs, and competitive demands continue to rise. In the semiconductor industry, a “re-spin” occurs when a chip design must be revised and manufactured again because… Read More


TSMC Powers Up: 408,000 Batteries Get a Safety Intelligence Upgrade

TSMC Powers Up: 408,000 Batteries Get a Safety Intelligence Upgrade
by Daniel Nenni on 05-25-2026 at 10:00 am

TSMC’s Lithium Iron Battery Generation Upgrade Project

As semiconductor manufacturing becomes increasingly dependent on uninterrupted power and energy efficiency, battery reliability has emerged as a critical operational issue for advanced fabs. Taiwan Semiconductor Manufacturing Company, better known as TSMC, is addressing this challenge through an ambitious global initiative… Read More


Power-SOI: The Reliability Engine Behind Functional Safety ICs

Power-SOI: The Reliability Engine Behind Functional Safety ICs
by Daniel Nenni on 05-25-2026 at 6:00 am

Power SOI The Reliability Engine Behind Functional Safety ICs

Power-SOI technology is rapidly emerging as a foundational platform for next-generation functional safety integrated circuits used in autonomous vehicles, industrial automation, humanoid robotics, and other mission-critical systems. The growing convergence of high-voltage power management and low-voltage digital… Read More


ASML High-NA EUV is Not Ready for High-Volume Production

ASML High-NA EUV is Not Ready for High-Volume Production
by Daniel Nenni on 05-22-2026 at 8:00 am

ASML Elephant High NA EUV

Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More


Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC

Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
by Daniel Nenni on 05-20-2026 at 10:00 am

SIemens EDA TSMC Teshnical Symposium 2026

At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More