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TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon

TSMC and Cadence Strengthen Partnership to Enable Next-Generation AI and HPC Silicon
by Daniel Nenni on 02-15-2026 at 6:00 pm

TSMC WAFER

TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More


Podcast EP331: Soitec’s Broad Impact on Quantum Computing and More with Dr. Christophe Maleville

Podcast EP331: Soitec’s Broad Impact on Quantum Computing and More with Dr. Christophe Maleville
by Daniel Nenni on 02-13-2026 at 10:00 am

Daniel is joined by Dr. Christophe Maleville, Chief Technology Officer and Senior Executive Vice-President of Soitec’s Innovation. He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer… Read More


TSMC vs Intel Foundry vs Samsung Foundry 2026

TSMC vs Intel Foundry vs Samsung Foundry 2026
by Daniel Nenni on 02-13-2026 at 6:00 am

TSMC vs Intel Foundry vs Samsung Foundry

The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel FoundryRead More


Gate-All-Around (GAA) Technology for Sustainable AI

Gate-All-Around (GAA) Technology for Sustainable AI
by Daniel Nenni on 02-09-2026 at 8:00 am

Gate All Around Technology for Sustainable AI SemiWiki

The transition from FinFET to Gate-All-Around (GAA) transistor technology represents a pivotal moment in the evolution of logic devices, driven by both physical scaling limits and the rapidly growing computational demands of artificial intelligence. As semiconductor technology approaches the sub-3 nm regime, traditional… Read More


TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce

TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce
by Daniel Nenni on 02-08-2026 at 2:00 pm

TSMC GCU Semiconductor Training Program

The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More


NanoIC Extends Its PDK Portfolio with First A14 Logic and eDRAM Memory PDK

NanoIC Extends Its PDK Portfolio with First A14 Logic and eDRAM Memory PDK
by Daniel Nenni on 02-04-2026 at 6:00 am

Nano IC TSMC Process Roadmap

NanoIC has announced a major expansion of its process design kit portfolio with the introduction of its first A14 logic and embedded eDRAM  memory PDK. This milestone reflects the company’s growing role in enabling advanced semiconductor design at cutting-edge technology nodes and addresses increasing industry demand for… Read More


TSMC’s 2026 AZ Exclusive Experience Day: Bridging Careers and Semiconductor Innovation

TSMC’s 2026 AZ Exclusive Experience Day: Bridging Careers and Semiconductor Innovation
by Daniel Nenni on 02-02-2026 at 8:00 am

TSMC AZ Day FAB 21

In February of 2026, Taiwan Semiconductor Manufacturing Company (TSMC) will host the TSMC AZ Exclusive Experience Day in Phoenix, Arizona, offering selected participants a rare opportunity to engage directly with one of the most advanced semiconductor manufacturing organizations in the world. The event will serve as an immersive… Read More


The Foundry Model Is Morphing — Again

The Foundry Model Is Morphing — Again
by Jonah McLeod on 01-29-2026 at 10:00 am

SIP Market

When Morris Chang left Texas Instruments in 1983 to found TSMC, he was not merely starting a new company—he was proposing a new industrial logic. Chang recognized that semiconductor manufacturing had become so capital-intensive that it could no longer survive as just one function inside a vertically integrated company.… Read More


The Chronicle of TSMC CoWoS

The Chronicle of TSMC CoWoS
by Daniel Nenni on 01-28-2026 at 10:00 am

Chronical of CoWoS

As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More


TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth

TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth
by Daniel Nenni on 01-25-2026 at 12:00 pm

TSMC's CoWoS® Sustainability

In a significant example of how high-tech manufacturing can embrace environmental stewardship without compromising operational excellence, Taiwan Semiconductor Manufacturing Company has launched a sustainability initiative within its advanced packaging operations that both reduces waste and generates meaningful… Read More