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Teradyne Unveils Magnum E2 for the Next Wave of AI Memory

Teradyne Unveils Magnum E2 for the Next Wave of AI Memory
by Daniel Nenni on 10-13-2026 at 10:00 am

High speed memory testing for AI

Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering and production… Read More


VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives

VSORA’s Sandra Rivera on the Inference Era: Demand Is Real, But Not Everyone Survives
by Lauro Rizzatti on 10-13-2026 at 8:00 am

Sandra Rivera SemiWiki

Sandra Rivera, Chair of VSORA, joined Bloomberg’s The Close in July for an interview on the current state of AI. What follows is a summary of that conversation.

When a Silicon Valley veteran who once ran Intel’s Data Center and AI Group, and now chairs a French inference-chip challenger, sits down with a tech journalist from Bloomberg,… Read More


Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs

Intel’s Open Software Blueprint: Why Production AI Needs More Than GPUs
by Daniel Nenni on 10-13-2026 at 6:00 am

Open software unites chips and AI

Intel’s strategic argument about enterprise AI is that the value of a model depends on the system that surrounds it. In an article by executives Bill Pearson and Anil Nanduri, the company positions open software as the connective tissue linking CPUs, GPUs, data, and business applications. The message is straightforward: accelerator… Read More


From 25 Million Pixels to a Six-Ounce Product: Engineering Visor for Manufacturing

From 25 Million Pixels to a Six-Ounce Product: Engineering Visor for Manufacturing
by Moh Kolb on 10-11-2026 at 8:00 am

By Dr. Moh Kolbehdari

Putting roughly 25 million pixels into a wearable device weighing about six ounces sounds, at first, like a display problem.

It is not.

The displays must fit behind an optical system capable of turning those pixels into a usable visual field. Compute must generate and move the required data. Power must support… Read More


TSMC 2026 OIP Ecosystem Forum Summary

TSMC 2026 OIP Ecosystem Forum Summary
by Daniel Nenni on 10-09-2026 at 8:00 am

TSMC Ecosystem Forum Summary

TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More


Data Center Energy Trends Force a Rethink of Chip Power Delivery

Data Center Energy Trends Force a Rethink of Chip Power Delivery
by Daniel Nenni on 10-08-2026 at 10:00 am

Data Center Energy Trends Force a Rethink of Chip Power Delivery

Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:

Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More


From Cloud to Silicon: IC-Link and TSMC Open the Door

From Cloud to Silicon: IC-Link and TSMC Open the Door
by Daniel Nenni on 10-07-2026 at 8:00 am

From Cloud to Silicon IC Link and TSMC Open the Door

Access to advanced semiconductor technology involves much more than choosing a process node. Design teams also need computing capacity, compatible tools, secure technology access, and experienced support. IC-Link by imec’s expanded collaboration with TSMC addresses that combination, potentially making sophisticated… Read More


Beyond the Die: Verifying the Connected Chip

Beyond the Die: Verifying the Connected Chip
by Daniel Nenni on 10-06-2026 at 10:00 am

Efficient, Scalable Methodology for Reliability and ESD Verification of Complex 3D IC CoWoS Systems

One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More


Built to Deliver the Answer, Not to Train the Model

Built to Deliver the Answer, Not to Train the Model
by Lauro Rizzatti on 10-06-2026 at 8:00 am

VSORA SemiWiki Post Sep 28 2026 Week


How VSORA rebalances memory and compute for AI inference in the data center and at the edge

For more than a decade, the AI hardware industry focused mainly on model training, while inference represented a smaller share of overall demand. That balance is changing as trained models are deployed widely in recommendation engines, … Read More


CEO Interview Greene Tweed

CEO Interview Greene Tweed
by Daniel Nenni on 10-02-2026 at 10:00 am

Greene Tweed

Magen Buterbaugh was appointed President and CEO of Greene Tweed in January 2023. A seasoned leader, with broad industry expertise, Magen has led multiple chemicals & materials-based businesses – spanning from startups to multibillion-dollar enterprises. She led and scaled new innovative research and development platforms… Read More