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The second chapter of our book “Fabless: The Transformation of Semiconductor Industry” describes the ASIC business and how important it is. That was more than 10 years ago and the ASIC business is still at the forefront of the Semiconductor industry and is a key enabler of the AI revolution we are experiencing today.
First let’s … Read More
The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More
The paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI) technology provides a robust defense against Laser Fault Injection (LFI), a precise, laboratory-grade attack method that can compromise cryptographic and safety-critical hardware. As vehicles become increasingly digital and connected, with dozens… Read More
The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More
Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More
GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More
In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon Liquid… Read More
In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More
In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More
In a move that underscores the semiconductor industry’s push toward resilient supply chains and agile innovation, Thalia Design Automation and X-FAB Silicon Foundries have announced a strategic partnership aimed at safeguarding supply continuity and accelerating intellectual property (IP) migration. This collaboration,… Read More
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Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business