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TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel

TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel
by Daniel Nenni on 11-28-2025 at 6:00 am

TSMC vs Wei Jen Lo

The big semiconductor news this week is the legal action TSMC is taking against former Senior Vice President Wei-Jen Lo. This looks to be a serious game of 3D chess between CC Wei and Lip-Bu Tan so it is worth a look. I got this notice in my inbox early Tuesday morning:

Immediately following, there was an interesting discussion on SemiWikiRead More


TSMC Kumamoto: Pioneering Japan’s Semiconductor Revival

TSMC Kumamoto: Pioneering Japan’s Semiconductor Revival
by Daniel Nenni on 11-07-2025 at 6:00 am

TSMC Kumamoto Fab 2

In the lush landscapes of Kumamoto Prefecture, on Japan’s Kyushu Island, TSMC is etching a new chapter in global chip production. The TSMC Kumamoto facility, operationalized through its wholly-owned subsidiary Japan Advanced Semiconductor Manufacturing (JASM), represents the Taiwanese giant’s bold foray… Read More


Memory Matters: The State of Embedded NVM (eNVM) 2025

Memory Matters: The State of Embedded NVM (eNVM) 2025
by Daniel Nenni on 11-06-2025 at 6:00 am

NVM Survey 25 Square Banner for SemiWiki 400x400 px

Make a difference and take this short survey. It asks about your experience with embedded non-volatile memory technologies. The survey is anonymous, and the results will be shared in aggregate to help the industry better understand trends: 2025 Embedded Non-Volatile Memory Survey.

We are now in the AI era where data is the lifeblood… Read More


Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business

Intel to Compete with Broadcom and Marvell in the Lucrative ASIC Business
by Daniel Nenni on 10-31-2025 at 6:00 am

Lip Bu Tan Intel

The second chapter of our book “Fabless: The Transformation of Semiconductor Industry” describes the ASIC business and how important it is. That was more than 10 years ago and the ASIC business is still at the forefront of the Semiconductor industry and is a key enabler of the AI revolution we are experiencing today.

First let’s … Read More


AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor Design

AI-Driven DRC Productivity Optimization: Revolutionizing Semiconductor Design
by Daniel Nenni on 10-28-2025 at 10:00 am

AI Driven DRC Productivity Optimization Siemens AMD TSMC

The semiconductor industry is undergoing a transformative shift with the integration of AI into DRC workflows, as showcased in the Siemens EDA presentation at the 2025 TSMC OIP. Titled “AI-Driven DRC Productivity Optimization,” this initiative, led by Siemens EDA’s David Abercrombie alongside AMD’s… Read More


FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics

FD-SOI: A Cyber-Resilient Substrate for Secure Automotive Electronics
by Daniel Nenni on 10-22-2025 at 10:00 am

Soitec white paper image

The paper highlights how Fully Depleted Silicon-On-Insulator (FD-SOI) technology provides a robust defense against Laser Fault Injection (LFI), a precise, laboratory-grade attack method that can compromise cryptographic and safety-critical hardware. As vehicles become increasingly digital and connected, with dozens… Read More


Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools

Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools
by Daniel Nenni on 10-12-2025 at 10:00 am

Employees are seen working on the final assembly of ASML's TWINSCAN NXE:3400B semiconductor lithography tool with its panels removed, in Veldhoven

The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More


Exploring TSMC’s OIP Ecosystem Benefits

Exploring TSMC’s OIP Ecosystem Benefits
by Daniel Nenni on 10-10-2025 at 6:00 am

TSMC Booth

Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More


GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters

GlobalFoundries, MIPS, and the Chiplet Race for AI Datacenters
by Jonah McLeod on 10-09-2025 at 6:00 am

GF MIPS

GlobalFoundries’ (GF) acquisition of MIPS in 2025 wasn’t a nostalgic move to revive a legacy CPU brand. It was a calculated step into one of the most lucrative frontiers in semiconductors: AI, high-performance computing (HPC), and datacenters. As Nvidia, AMD, Intel, and hyperscalers embrace chiplet architectures, GF is betting… Read More


Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®

Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
by Daniel Nenni on 10-08-2025 at 8:00 am

ETC 2025 TSMC

In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon LiquidRead More