Podcast EP207: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis

Podcast EP207: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis
by Daniel Nenni on 02-09-2024 at 10:00 am

Dan is joined by Nick Ilyadis, vice president of product planning at Achronix. Prior to Achronix, Nick was vice president of portfolio and technology strategy at Marvell Semiconductor and vice president and group CTO at Broadcom. Nick has also held many engineering roles during his career, starting as a chip designer and moving up through management to lead both device and product engineering teams. Nick is passionate about technology and a prolific inventor with 75 issued patents across all aspects of wired and wireless communications.

Nick describes how Achronix FPGA technology is enabling new types of designs with a focus on AI enablement. The strategies used to develop multi-die, chiplet-based designs and the various ways Achronix is making new design approaches a reality through technology development and partnerships are also discussed.

The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.

Semiconductor Insiders
Semiconductor Insiders
Podcast EP207: How Achronix is Enabling Multi-Die Design and a Chiplet Ecosystem with Nick Ilyadis
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