The current methodology in design in most companies, and certainly many of the biggest, is that front end RTL design is done by one team with a limited set of front-end design tools. This is then eventually passed off to the physical design team who run all the scripts, do the “real” synthesis, place & route and timing… Read More
Interface Protocols, USB3, PCI Express, MIPI, SATA… the winners and losers in 2012
Who makes the decision and declare that a specific interface protocol is successful? Not me, as I can only consolidate market share data and some insight information coming from the industry. The end user, when going to a shop (real or virtual) and spend a significant part of his budget to buy an electronic product, selecting among… Read More
OTP @ 2013 Common Platform Technology Forum
Sidense will be exhibiting at the Common Platform Technology Forum in Santa Clara, California on February 5, during which time they will be discussing their one-transistor, one-time programmable (1T-OTP) memory IP products. Based on their patented 1T-Fuse™ bit cell, Sidense antifuse-based 1T-OTP macros offer a secure, reliable,… Read More
Will Google Go Thermonuclear?
“It’s not like we started it,” said Larry. “After all the idea of going Thermonuclear was first broached by Steve to Eric at their outdoor café meeting in Palo Alto way back in 2010. We’re just following by example and as Steve was wont to quote Picasso; “good artist copy, great artist steal” so why not go Thermonuclear with our Android… Read More
Celebrity Electronics Show 2013 (CES)
Time to pack up for the 2013 Consumer Electronics Show in Las Vegas, I will be driving down with my beautiful wife Shushana because she does not like to fly. The drive takes the better part of a day so we will leave early and see the sunrise over the desert. She is great company, the time will fly by. We will be 2 of the more than 150,000 people… Read More
Online Schematic Capture and SPICE Circuit Simulation
I love all things SPICE so when I read a tweet tonight from @PartSimI just had to try out their Schematic Capture and SPICE circuit simulator in a browser. The site is www.partsim.com and all you need is a web browser and short registration process, then it’s off to the Examples where I found a simple CMOS inverter and then extended… Read More
Tech Forum, February 5, features 32/28-, 20-, 14-, and 10-nanometer processes
The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcase… Read More
Audio/Voice DSP IP core: the next road to billion unit shipment
When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering… Read More
Engineer to Engineer, Embedded Instrumentation
Last month the folks at Tektronix did something very useful, they invited 30 engineers to talk directly with their chief engineer of embedded instrumentation as part of “Meet the Experts” in Santa Clara, CA.
Brad Quinton, Chief Architect created a new and efficient approach of embedding instrumentation in your … Read More
Apple’s Next Threat
It seems only appropriate that at the beginning of the year we should look at who is going to be the next significant threat to Apple’s profitability machine. During Apple’s meteoric rise over the past 9 years (APPL share price: Jan-2004 @ $11 vs. Jan-2013 @ $550) different companies have been put up as Apple’s next significant threat… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?