Baseball loves a good switch hitter – from Frisch to Mantle to Rose to Murray to Jones, they are a rare and valuable commodity. AMD is calling on ambidexterity for its processors in 2015 and beyond, this week tipping plans for 20nm “Project SkyBridge” parts in either ARM or X86 with a common footprint. What remains to be seen is where… Read More
Think Quantum Computing is Hype? Mastercard Begs to DisagreeJust got an opportunity to write a blog…Read More
TSMC Kumamoto: Pioneering Japan's Semiconductor RevivalIn the lush landscapes of Kumamoto Prefecture, on…Read More
Memory Matters: The State of Embedded NVM (eNVM) 2025Make a difference and take this short survey.…Read More
5 Lessons the Semiconductor Industry Can Learn from GamingBy Kamal Khan The semiconductor world has always…Read More
4G BaseBand Support with TeakLite4? Add Also CEVA-Bluetooth!
The CEVA-TeakLite-4 is the DSP IP issued from the TeakLite family, started about 15 years ago with the 16-bit, single MAC TeakLite. Now the TeakLite-4 is a 32-bit, quad MAC IP core, supporting 2G/3G/4G Wireless BaseBand or PowerLine Communication. But even the latest BaseBand computational requirement doesn’t saturate this… Read More
Wearables at Linley Mobile: Diverging views
The Linley Mobile Conference last week initiated a lot of discussion about emerging technologies and markets, especially wearables. Jessica Lipsky’s EE Times article captured some of the sentiments in her article, “Wearables Need Tailored SoCs.” But the conference covered a lot more ground than wearables, including mobile… Read More
Analog and Full Chip Simulation at Micron
IDM companies like Micronuse SPICE circuit simulators during the design phase in order to predict timing, currents and power on their custom IC chip designs at the transistor level. A senior memory design engineer at Micron named Raed Sabbahtalked today at a webinarabout how the embedded solutions group uses the FineSimcircuit… Read More
Get that Smartphone Chip out of my Wearable!
Last week, I had the pleasure to present at the Linley Group Mobile Conference. My presentation was part of the Wearable Device Session, which examined wearables from several different angles including software, sensor, processor, and IP.
As the smartphone market is maturing and the pace of innovation generally slowing, there… Read More
What Executives Say About IP Licensing
In the fabless world of semiconductor design, IP components have become indispensable partners and have enabled the development of complex billion gate SoCs. IP business in general is exhibiting a very high growth rate since couple of years and it is going to increase; the same is being reflected by a growing number of IP vendors… Read More
180nm still a big deal
When I was reading the recent Daniel Payne article “Designing Change Into Semiconductor Techonomics” with commentary on a recent presentation from Aart de Geus of Synopsys, one chart jumped out at me: the most popular process node for new design starts today is 180nm.
Upon mentioning that to a few of my IoT counterparts, they quickly… Read More
Intel is Still Missing Mobile!
Paul McLellan was on assignment in Hong Kong last week so I attended the Linley Mobile Conference and was not surprised Intel did not present. During the networking sessions I asked more than a dozen people why and the answers were pretty focused on “Intel still does not play well with others” and “Intel’s current mobile offerings… Read More
Processors For Internet of Things
Tomorrow and Thursday this week is the Internet of Things (IoT) developers conference. It takes place at the Hyatt Regency in Santa Clara. There are 3 keynotes and 3 CTO viewpoints:
- Driving Heterogeneous System Architectures Everywhere – Amit Rohatgi, Imagination Technologies
- Solving the Networking Puzzle: From IOT
New Method for Metrology with sub-10 nm Lithrography
NewPath Research will describe their new method for nanoscale carrier profiling in semiconductors on May 19[SUP]th[/SUP] at the Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. This new method is intended to fill the gap that has been addressed in the Roadmaps for the semiconductor… Read More
AI RTL Generation versus AI RTL Verification