Designing SOC’s for markets like automotive and mobile electronics requires taking advantage of every opportunity for optimization. One way to do this is through building a cache coherent system to boost speed and reduce power. Recently, NXP decided to go about this on their automotive MCU based SOC’s by using Arteris’ just-announced… Read More
Unlocking Efficiency and Performance with Simultaneous Multi-ThreadingAn Akeana hosted webinar on Simultaneous Multi-Threading (SMT)…Read More
DAC TechTalk – A Siemens and NVIDIA Perspective on Unlocking the Power of AI in EDAAI was everywhere at DAC. Presentations, panel discussions,…Read More
Synopsys Webinar – Enabling Multi-Die Design with IntelAs we all know, the age of multi-die…Read More
DRC Concept for IP Qualification and SoC Integration
In the history of semiconductor design and manufacturing, the age-old concept of DRC rule-deck qualification for handshake between design and manufacturing still applies strongly to produce working silicon. In fact, DRC clean GDSII works as the de facto golden gate between a design and a foundry for manufacturing the chip for… Read More
Aart de Geus, Technomics and #53DAC
The number one EDA+IP vendor in our industry today is Synopsys, and their eloquent leader is Aart de Geus, so I expect that the Monday interview at #53DAC on June 6th will be well attended and worthwhile to witness in the DAC Pavilion, start time is 11:30AM, so arrive early to get a seat. One of Aart’s coined words is Technomics,… Read More
Six Reasons to Visit Cadence at #53DAC this Year in Austin
For bloggers like myself spending four days at #53DAC is almost a non-stop blur of activity, visiting EDA vendors, IP providers and foundries to learn about what’s happening in our semiconductor industry. Cadence is both an EDA vendor and IP provider, so DAC is a great showcase for them to tell us what’s new in 2016 and… Read More
What the #3 EDA company is showing at #53DAC this year
I live in Tualatin, Oregon just a few miles away from the corporate headquarters of the #3 EDA company in the world, Mentor Graphics. Since DAC is fast approaching, I thought it would be useful to give you a quick overview of what Mentor is going to be talking about in Austin, Texas during June 5-9. … Read More
Power Noise Sign-off at #53DAC
When I hear the company name of ANSYS the first EDA tool category that comes to mind is power noise sign-off. Going to DAC is a great way to find out what’s new with EDA, IP and foundries. There are three places that you can find ANSYS at DAC this year:… Read More
IMEC Technology Forum (ITF) – EUV When, Not If
For me personally EUV has been something of a roller coaster ride over the last several years. I started out a strong believer in EUV but then at the SPIE Advanced Lithography Conference in 2014 TSMC gave a very negative assessment of EUV, and there was a SEMATECH paper on high NA EUV that struck me as extremely unlikely to succeed. I … Read More
Moving chips from industrial to industrial IoT
IHS has put out its 1Q2016 Application Market Forecast predicting the highest growth rate segments for semiconductors over the next five years – and what was once old is new yet again. There it is, in the top right corner: industrial, projected to outpace even the automotive sector.… Read More
How TSMC Tackles Variation at Advanced Nodes
The design community is always hungry for high-performance, low-power, and low-cost devices. There is emergence of FinFET and FDSOI technologies at ultra-low process nodes to provide high-performance and low-power requirements at lower die-size. However, these advanced process nodes are prone to new sources of variation.… Read More
Google, Deep Reasoning and Natural Language Understanding
Understanding natural language is considered a hard problem in artificial intelligence. You could be forgiven for thinking this can’t be right – surely language recognition systems already have this problem mostly solved? If so, you might be confusing recognition with understanding – loosely, recognition is the phonology… Read More
Should Intel be Split in Half?