Cycuity’s Radix-ST represents a groundbreaking advancement in semiconductor security, addressing the growing complexity and vulnerability of modern chip designs. Introduced on August 27, 2025, by Cycuity, Inc., Radix-ST leverages static analysis techniques to identify and resolve security weaknesses early in the chip… Read More
Capability Hardware Enhanced RISC Instructions CHERI AllianceThe CHERI Alliance is a non-profit organization dedicated…Read More
Operationalizing Secure Semiconductor Collaboration: Safely, Globally, and at ScaleSemiconductor manufacturing is among the most complex industrial…Read More
Keynote: On-Package Chiplet Innovations with UCIeIn the rapidly evolving landscape of semiconductor technology,…Read More
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus Race to CompeteThe semiconductor industry is in the midst of…Read MoreSmart Verification for Complex UCIe Multi-Die Architectures
By Ujjwal Negi – Siemens EDA
Multi-die architectures are redefining the limits of chip performance and scalability through the integration of multiple dies into a single package to deliver unprecedented computing power, flexibility, and efficiency. At the heart of this transformation is the Universal Chiplet Interconnect… Read More
PDF Solutions Adds Security and Scalability to Manufacturing and Test
Everyone knows design complexity is exploding. What used to be difficult is now bordering on impossible. While design and verification challenges occupy a lot of the conversation, the problem is much bigger than this. The new design and manufacturing challenges of 3D innovations and the need to coordinate a much more complex … Read More
Revolutionizing Processor Design: Intel’s Software Defined Super Cores
In the ever-evolving landscape of computing, Intel’s patent application for “Software Defined Super Cores” (EP 4 579 444 A1) represents a groundbreaking approach to enhancing processor performance without relying solely on hardware scaling. Filed in November 2024 with priority from a U.S. application… Read More
TSMC’s 2024 Sustainability Report: Pioneering a Greener Semiconductor Future
TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More
Intel’s Commitment to Corporate Responsibility: Driving Innovation and Sustainability
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
CEO Interview with Rabin Sugumar of Akeana
Rabin Sugumar was Distinguished Engineer and Chief Architect at Marvell/Cavium and built and led the architecture group for the ThunderX Arm server processor line. Most recently he led the architecture of the ThunderX3 processor, which had industry leading single thread performance and socket level performance at time of … Read More
RANiX Employs CAST’s TSN IP Core in Revolutionary Automotive Antenna System
This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More
Podcast EP306: The Challenges of Advanced AI Data Center Design with Josue Navarro
Dan is joined by Josue Navarro, product marketing engineer for Microchip’s dsPIC business unit. He began his career as a process engineer at Intel and has since transitioned into product marketing with Microchip Technology where he supports customers developing system designs utilizing Microchip’s Digital Signal … Read More
Cadence’s Strategic Leap: Acquiring Hexagon’s Design & Engineering Business
In a bold move that underscores the accelerating convergence of electronic design automation (EDA) and mechanical engineering, Cadence Design Systems announced its agreement to acquire Hexagon AB’s Design & Engineering (D&E) business for approximately €2.7 billion, equivalent to about $3.16 billion. This… Read More


Things From Intel 10K That Make You Go …. Hmmmm