Artificial intelligence and machine learning have undergone incredible changes over the past decade or so. We’ve witnessed the rise of convolutional neural networks and recurrent neural networks. More recently, the rise of generative AI and transformers. At every step, accuracy has been improved as depicted in the graphic… Read More
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Heterogeneous 2D/3D Packaging Challenges
A growing trend in system design is the use of multiple ICs mounted in advanced packages, especially in high-performance computing and AI. These modern packages now integrate multiple ICs, often with high-bandwidth memory (HBM), resulting in hundreds of thousands of connections that need proper verification. Traditional… Read More
Accelerating Automotive SoC Design with Chiplets
The automotive industry is evolving rapidly with the increasing demand for intelligent, connected, and autonomous vehicles. Central to this transformation are System-on-Chip (SoC) designs, which integrate multiple processing units into a single chip for managing everything from safety systems to in-car entertainment.… Read More
Cadence Paints a Broad Canvas in Automotive
Cadence recently launched a webinar series on trends and challenges in automotive design. They contribute through IP from their Silicon Solutions Group, a comprehensive spectrum of design tooling and through collaborative development within a wide partner ecosystem. This collaboration aims to support and advance progress… Read More
CEO Interview: Wendy Chen of MSquare Technology
Wendy Chen, MBA from the University of Manchester, has been the Founder and CEO of MSquare Technology since 2021. With over 23 years in the semiconductor industry, Wendy’s career includes roles as Sales Director at Synopsys Technology, Vice President at TF-AMD, and Vice President at Alchip Asia Pacific. Her extensive experience… Read More
Keysight EDA and Engineering Lifecycle Management at #61DAC
Entering the exhibit area of DAC on the first floor I was immediately faced with the Keysight EDA booth, and it was even larger than either the Synopsys or Cadence booths. They had a complete schedule of partners presenting in their theatre that included: Microsoft Azure, Riscure, Fermi Labs, BAE Systems, Alphawave, Intel Foundry,… Read More
First third-party ISO/SAE 21434-certified IP product for automotive cybersecurity
Increased processing and connectivity in automobiles are cranking up the priority for advanced cybersecurity steps to keep roads safe. Electronic vehicle interfaces, including 5G/6G, Bluetooth, Wi-Fi, GPS, USB, CAN, and others, offer convenience features for drivers and passengers, but open numerous attack vectors for… Read More
CAST, a Small Company with a Large Impact on Many Growth Markets #61DAC
Semiconductor IP has continued to grow as a market, and it was clearly a star performer at #61DAC. We all know the large suppliers of IP for semiconductors, but the market is actually quite diverse, with many players supporting many applications. I had a chance to meet with two executives from CAST, a company with a remarkably … Read More
Sigasi at the 2024 Design Automation Conference
Sigasi® will demonstrate its Sigasi Visual HDL™ (SVH™) portfolio during DAC, showing how it supports the shift-left methodology for chip design, catching specification errors early in the design cycle and fixing the inefficient HDL-based design flow.
The traditional HDL workflow cannot accommodate the massive amounts of… Read More
Arteris at the 2024 Design Automation Conference
Arteris, a leading provider of system IP, will exhibit at DAC 2024, June 23-27, booth #1506. The company will demonstrate its latest technology including network-on-chip interconnect IP and SoC integration automation solutions. The products highlighted include CSRCompiler, Ncore Cache Coherent NoC IP and FlexNoC 5 interconnect… Read More
Intel Foundry Delivers!